Multi-Chamber PVD Module for Higher Throughput Deposition
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Solution Overview
Problem
PVD processing is often expensive and time-consuming due to the need for dedicated reactors for each material deposition, and it typically processes only a single substrate at a time, leading to inefficiencies in advanced packaging and integration of electronic devices.
Innovation Solution
A system with a load lock chamber, multiple PVD chambers, substrate handling chamber, and a robot with end effectors, allowing for the movement of substrates between degas, preclean, and PVD modules, enabling simultaneous processing of multiple substrates and independent control of process conditions in each chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dedicated PVD reactors are used for each material deposition, then deposition uniformity and film property uniformity are improved, but processing time and cost increase
Solution Approach 1:
The PVD module is designed with multiple PVD chambers (first PVD chamber, second PVD chamber, etc.) that can process different materials within a single integrated module. This multi-functional design allows the system to maintain dedicated reactor benefits for each material while reducing overall processing time by eliminating the need to switch between separate dedicated reactors.
Solution Approach 2:
The PVD module is segmented into multiple independent PVD chambers, each capable of processing different materials. This segmentation allows simultaneous or sequential processing of multiple substrates with different material deposition requirements within a single module, improving throughput while maintaining the precision of dedicated reactors.
2Manufacturing precision
If dedicated PVD reactors are used for each material deposition, then film property uniformity is improved, but processing cost increases
Solution Approach 1:
By integrating multiple PVD chambers into a single module with shared infrastructure (vacuum system, substrate handling, control systems), the system achieves the film quality of dedicated reactors while reducing the total number of separate reactor units needed, thereby lowering capital expenditure and operational costs.
Solution Approach 2:
Multiple PVD chambers are merged into a single integrated module that shares common support infrastructure including vacuum pumping systems, substrate transfer mechanisms, and control systems. This consolidation reduces redundant equipment and lowers overall processing costs while maintaining the precision of individual chambers.
3Manufacturing precision
If single substrate processing is used, then process control precision is improved, but productivity decreases
Solution Approach 1:
The substrate processing system is segmented into multiple independent processing chambers within the PVD module, allowing multiple substrates to be processed simultaneously or in rapid succession. Each chamber maintains independent process control for precision while the overall system throughput is multiplied by the number of chambers.
Solution Approach 2:
The system enables continuous processing by having multiple PVD chambers available simultaneously, eliminating idle time between substrate processing cycles. While one chamber is processing a substrate, another chamber can be preparing or finishing a different substrate, maintaining continuous productive action across the module.
4Productivity
If multiple PVD chambers are integrated in one module, then productivity is improved, but device complexity increases
Solution Approach 1:
Multiple PVD chambers are merged into a single integrated module that shares common infrastructure including vacuum systems, substrate handling mechanisms, and control systems. This consolidation reduces the overall complexity compared to having completely separate dedicated reactors for each chamber, as shared systems eliminate redundant components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates rapid and efficient deposition of multiple materials on substrates, improving throughput and reducing costs by allowing simultaneous processing of multiple substrates with precise control over deposition conditions.
Implementation Method 1
a robot within the substrate handling chamber, the robot comprising an arm comprising one or more end effectors, each end effector configured to receive one or more substrates, and a controller configured to cause the robot to move the one or more substrates
Implementation Method 2
The lamp can provide one or more of infrared light or ultraviolet light to a surface of a substrate to provide desired heat to the substrate
Implementation Method 3
a susceptor, also referred to herein as a pedestal, within the degas module can include a heater, such as a resistive heater
Implementation Method 4
The degas module can include a turbomolecular pump, a cryopump, or both coupled to one (e.g., each) or two or more degas chambers
Implementation Method 5
The preclean module can similarly include two or more preclean chambers. In accordance with examples of the disclosure, one or more (e.g., each) of the preclean chambers includes a capacitively coupled plasma (CCP) chamber or an inductively coupled plasma (ICP) chamber
Implementation Method 6
Physical vapor deposition (PVD) processes can be used for a variety of applications. By way of example, PVD can be used for advanced packaging applications during the manufacture, integration, and heterogenous integration of electronic devices
Data Source
AI summary
Physical vapor deposition (PVD) systems and modules are disclosed. Exemplary systems can include one or more PVD modules, a degas module, a preclean module, and/or one or more ancillary modules. The ancillary modules can be used as cool down modules, metrology modules, or the like.