Vacuum Evaporation Coating TRIZ Cases

Recessed protruding spacers keep a narrow mask-substrate gap to cut deposition blur while avoiding circuit damage and screen-printing cost.

A rotating tapered filter passage shapes the plasma plume and traps slower particles for more accurate pulsed laser deposition.

A layered titanium, tantalum oxide, and iridium-tantalum electrode extends acidic electrolysis life by limiting iridium loss and corrosion.

Alternating electrode and mask pitches break display periodicity, cutting diffracted light intensity while preserving high pixel density.

A multilayer low-E glass coating uses Ni-Cr-Mo and silver sputtered layers to cut solar heat gain while preserving visible light transmission.

Electrostatic holding and matrix anti-separation frames stabilize large substrates for precise mapping and coordinate correction during deposition.

Direct PVD metal coating on plastic avoids plasma pre-treatment and base hard-coats, preserving texture while resisting UV and thermal stress.

A PVD zinc nanocrystal coating makes flat steel directly paintable while letting diffusible hydrogen escape to reduce embrittlement.

Pressure-modulated PVD tunes metal film adhesion for sensor fabrication, enabling stable processing, clean release, and reduced electrode interaction.

A multilayer Al-Si-O/N coating with a Si- or Al-rich intermediate layer improves adhesion and resists corrosion and erosion on hot components.

In situ hydrolysis broadens organotin ligand options while preserving processability for low-dose EUV patterning and smoother line widths.

Seed crystals placed in amorphous alloys before annealing control grain size, orientation, and phase while lowering crystallization temperature.

Air injection and lift control separate the mask frame from the stage during welding to reduce friction, misalignment, and deformation.

A bellows-fed OVJP injection block maintains gas flow and thermal stability during vertical motion for precise large-area OLED deposition.

Matching Invar-based mask parts to glass thermal expansion preserves alignment during vapor deposition and improves OLED pattern accuracy.

Alternating AX deposition and pause phases lets diffusion complete in BX2 films, improving stoichiometry and uniformity in large-area perovskite production.

Eccentrics and a wobbling driver cut rotating parts in a substrate carrier, reducing blockage risk and keeping coating torque uniform.

A perforated plate controls local grating height during deposition, boosting AR waveguide scattering modulation while simplifying fabrication.

A plasma jet quenched in liquid enables high-rate production of amorphous and nanocrystalline nanomaterials while limiting nanoparticle agglomeration.

A threaded semi-cylindrical catalyst film uses alumina support and oxide shell protection to burn low-concentration gases at lower temperatures.

A magnetic layer on the mask membrane improves adhesion to the backplane substrate, enabling precise OLED deposition for 3000 PPI displays.

A rotating multi-station substrate holder automates sample exchange in laser-heated PVD, avoiding repeated venting and boosting daily throughput.

Crystal-oriented patterning in a laminate silicon mask improves opening precision and etching uniformity for display deposition.

Opposed taper angles in a metal evaporation mask reduce cracking, chipping, and film defects in high-density OLED panel deposition.

A SixNy coating balances high refractive index with hardness, scratch resistance, low stress, and durability for 3C glass and plastic surfaces.

Divided mask sheets are joined on a support plate with movable clamps to control sagging, improve flatness, and cut large-mask manufacturing cost.

Separate heated material compartments and a vapor guide stabilize OLED evaporation while limiting thermal degradation and impurities.

Layered optical coatings with position-tuned thickness and hard materials keep curved substrates low-reflective, color-stable, and abrasion resistant.

Overlapping deposition masks build a stacked cathode that lowers resistance between adjacent electrodes while preserving light transmittance.

Multiple heated deposition sources move across the substrate to improve edge-layer uniformity and complete multi-material coating in one step.

Power-cycled dual-target sputtering creates steep compositional gradients that keep metallic glass films amorphous at higher temperatures.

A three-layer OLED encapsulation layout uses roughness-controlled inorganic regions to contain organic flow and prevent Mura defects.

Individually controlled radical irradiation improves GaN sputtering at lower temperatures, enabling reliable micro LED film growth on glass substrates.

A welding-groove mask assembly improves opening rate and interface flatness to reduce shadowing and non-uniform light-emitting deposition.

Split island portions and rib-supported through-holes make OLED deposition patterns more uniform, improving mask reliability and deposition efficiency.

Vertical self-assembly of PZT and MgO increases interface area to raise dielectric film energy density, breakdown strength, and stability.

Two-stage AlN film deposition and high-temperature sintering fill surface pores to improve flatness, strength, and thermal conductivity.

A TOF camera tracks target erosion inside the PVD chamber, enabling parameter adjustment and timely replacement to reduce arcing and keep coatings consistent.

Heterogeneous material patterns and rib grooves counter membrane deformation to keep pixel opening gaps uniform in high-resolution deposition masks.

Keeping oxygen at 32% or less in a sputtered metal underlayer improves conductive carbon bonding to substrate films and helps prevent peeling.

Multiple PVD chambers with shared substrate handling enable parallel deposition, cutting processing time and cost while preserving film uniformity.

Direction-specific through-hole sizes, ribs, and island portions improve OLED deposition uniformity while preventing mask bending.

A metal foil, transition layers, and low-temperature alloy layers contain liquid metal to prevent leakage, sagging, and voids while keeping low thermal resistance.

Controlled nanowell aspect ratios limit metal buildup inside wells, enabling thicker, more uniform nanohole mesh deposition on land areas.

Changing evaporation source tilt and motion improves etching stopper placement, protecting OLED organic layers and electrodes from reliability loss.

Higher-index light extraction layers in non-opening OLED regions refract more light through the cathode to improve transparent display transmittance.

A dual load lock lets powder barrels be pre-evacuated, backfilled, and transferred under stable reactor conditions to cut cycle time and contamination.

Differential dielectric heating lets semiconductor films reach different temperatures, enabling selective deposition without extra etching and cleaning.

Angling the vapor ejector controls metallic vapor trajectory, cutting backside contamination while improving deposition yield and surface quality.

Controlled edge and branch widths in a mask stick improve alignment and emissive layer deposition precision for high-resolution displays.