Sputtered Electrode Underlayer for Carbon Film Adhesion
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Solution Overview
Problem
Existing electrodes face limitations in achieving excellent adhesiveness between the conductive carbon layer and the substrate film, leading to potential peeling issues.
Innovation Solution
The electrode design includes a metal underlying layer with an oxygen ratio of 32% or less, formed using specific sputtering conditions, ensuring high adhesiveness by incorporating metals like titanium or niobium, and a conductive carbon layer with sp2 and sp3 bonds, all produced via controlled sputtering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal underlying layer is formed using conventional sputtering methods, then the conductive carbon layer can be deposited, but the adhesiveness between the conductive carbon layer and substrate film is insufficient
Solution Approach 1:
The invention changes the oxygen content parameter in the metal underlying layer from conventional high levels to 32% or less, which fundamentally alters the adhesive properties. This parameter change enables the conductive carbon layer to achieve excellent adhesiveness to the substrate film without peeling issues
Solution Approach 2:
The invention creates a composite structure with specific composition ratios in the metal underlying layer, combining metal materials with controlled oxygen content to achieve optimal adhesive properties. The composite nature of the metal underlying layer with precise compositional control enables both structural integrity and adhesive performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting electrode exhibits enhanced adhesiveness, with the conductive carbon layer maintaining strong bonding to the substrate film, improving durability and performance.
Implementation Method 1
The metal underlying layer described in Patent Document 1 is formed on a one-side surface of the substrate film using sputtering. In the sputtering, the pressure in the sputtering chamber is reduced, and thereafter a sputtering gas is introduced into the sputtering chamber.
Data Source
AI summary
An electrode includes a substrate film, a metal underlying layer, and a conductive carbon layer in sequence toward one side in the thickness direction. In the metal underlying layer, the ratio R of oxygen is 32% or less in terms of atom and obtained by the following formula.R=100×[X1/(X0+X1)]X1: the atomic ratio (atomic %) of the oxygen in the metal underlying layer 3 X0: the atomic ratio (atomic %) of the metal material in the metal underlying layer 3.