Vacuum Deposition Ejector Angle to Reduce Backside Metal Contamination
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Solution Overview
Problem
Existing methods for depositing metal coatings on one side of a substrate result in significant contamination of the opposite side, leading to decreased deposition yield and surface quality.
Innovation Solution
A method and facility where metallic vapor is ejected through a vapor ejector positioned at a specific angle α, satisfying the equation (D1+D2)+Le sin α+We cos α=Ws, with D1 and D2 being the distance from the ejector edges to the substrate edges, controlling the vapor trajectory to minimize contamination on the opposite side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the vapor ejector is positioned perpendicular to the substrate (α=0°) to maximize deposition efficiency, then the deposition yield is improved, but the metal vapor contaminates the opposite side of the substrate significantly
Solution Approach 1:
The patent applies asymmetry by positioning the vapor ejector at a specific angled orientation (α) relative to the substrate normal, rather than perpendicular alignment. This asymmetric positioning creates an oblique vapor trajectory that deposits metal primarily on the intended side while minimizing cross-contamination to the opposite side, resolving the contradiction between deposition efficiency and contamination control
Solution Approach 2:
The patent changes the geometric parameter of ejector positioning from perpendicular (α=0°) to a specific angled position (α) that satisfies the equation (D1+D2)+Le sin α+We cos α=Ws. This parameter change optimizes the vapor trajectory to achieve both high deposition yield on the target side and minimal contamination on the opposite side
2Area of stationary object
If the ejector slot width (We) is increased to cover the entire substrate width, then the deposition coverage is improved, but the vapor trajectory becomes uncontrolled and increases contamination on the opposite side
Solution Approach 1:
The patent applies local quality by using a narrow ejector slot (We) that is smaller than the substrate width, combined with angled positioning. This creates a localized, controlled vapor jet that deposits metal precisely on the intended area while maintaining trajectory control, avoiding the uncontrolled spread that occurs with full-width slots
3Productivity
If the distance from ejector to substrate edges (D1, D2) is reduced to zero, then the deposition efficiency is maximized, but the vapor directly contaminates the opposite side of the substrate
Solution Approach 1:
The patent introduces angular positioning (α) as an additional dimensional parameter to control vapor trajectory. By positioning the ejector at an angle rather than directly perpendicular, the vapor travels along an oblique path that deposits on the target side while naturally avoiding direct contamination of the opposite side, effectively using spatial geometry to resolve the contradiction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces metal accumulation on the opposite side of the substrate, improving deposition yield and surface quality by controlling the vapor trajectory.
Implementation Method 1
a layer of at least one metal is formed on said side by condensation of ejected vapor
Implementation Method 2
a metallic vapor spray, propelled at a speed greater than 500 m/s, comes in contact with the substrate
Data Source
AI summary
A coated substrate obtainable by a method for continuously depositing, on a running substrate, coatings formed from at least one metal inside a vacuum deposition facility including a vacuum chamber. A vacuum deposition facility for producing such coated substrates.