OLED Evaporation Source Tilting for Precise Etching Stopper Deposition

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Solution Overview

Problem

The manufacturing process of OLED display devices faces challenges in maintaining reliability due to issues related to the formation of organic layers and electrodes, which can lead to reduced performance and durability.

Innovation Solution

A manufacturing method involving the formation of a rib and partition structure on the substrate, combined with an evaporation device that changes the inclination of the evaporation source relative to the substrate during deposition, ensures precise placement of etching stopper layers to enhance the reliability of the organic layers and electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the evaporation source is inclined relative to the normal of the processing substrate during deposition, then the manufacturing precision of the etching stopper layer is improved, but the device complexity increases

Engineering Contradiction:
Improveetching stopper layer deposition precisionVSAvoidevaporation device structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The evaporation source is configured to be movable relative to the processing substrate, allowing dynamic adjustment of the inclination angle during deposition. This enables precise control of material deposition patterns without requiring a permanently complex fixed structure, resolving the contradiction between precision and device complexity

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The inclination angle of the evaporation source is used as a controllable parameter to optimize deposition precision. By adjusting this single parameter during the deposition process, high manufacturing precision is achieved without permanently increasing device complexity through fixed structural modifications

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the relative positions of the evaporation source and processing substrate are changed during deposition, then the manufacturing precision is improved, but the loss of time increases

Engineering Contradiction:
Improvematerial placement precisionVSAvoiddeposition process time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The evaporation source position and inclination angle are pre-configured according to the required deposition pattern before material deposition begins. This preliminary setup eliminates the need for time-consuming adjustments during the actual deposition process, achieving high precision without excessive time loss

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The deposition process is designed to maintain continuous material deposition while the evaporation source moves. By ensuring continuous useful action rather than intermittent deposition during position changes, the time penalty for achieving precision is minimized

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach prevents the reduction in reliability by ensuring accurate deposition of materials, thereby improving the durability and performance of OLED display devices.

Implementation Method 1

depositing a material emitted from the evaporation source

Methodology Applied
Scientific EffectVapor deposition: Physical Vapour Deposition

Data Source

PatentUS12557540B2Manufacturing method of display device and evaporation device
Publication Date: 2026.02.17 MAGNOLIA WHITE CORP
  • US12557540B2 patent drawing
  • US12557540B2 patent drawing
  • US12557540B2 patent drawing

AI summary

According to one embodiment, a processing substrate is prepared. An organic layer is formed. An etching stopper layer is formed. The forming the etching stopper layer includes, in a first mode, inclining an evaporation source, and depositing a material emitted from the evaporation source while relative positions of the evaporation source and the processing substrate are changed, and in a second mode, inclining the evaporation source in a manner different from the first mode, and depositing the material emitted from the evaporation source while the relative positions of the evaporation source and the processing substrate are changed in an opposite manner of the first mode.