Multi-Chip Carrier Structure for Gentle LED Chip Release

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Solution Overview

Problem

The challenge in manufacturing optoelectronic displays lies in achieving a defect-free transfer and accurate positioning of inorganic LED chips onto a backplane or carrier without causing damage or tilting, while also minimizing the risk of defects and costs.

Innovation Solution

A support structure with receiving elements connected to a carrier substrate is used to securely hold LED chips in place. These receiving elements are designed to releasably hold the LEDs with a defined minimum force, allowing for easy detachment and transfer without damaging the chips or the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If strong holding forces are used to secure LED chips during transfer, then the chips are held securely in place, but the chips may be damaged or tilted during detachment

Engineering Contradiction:

Improvesecure hold of LED chipsVSAvoiddamage or tilting of LED chips

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The support structure is divided into multiple receiving elements (at least two) that are distributed across the carrier substrate. Each receiving element independently holds a portion of the LED chip, distributing the holding force and reducing stress concentration on any single chip location during both secure holding and detachment phases

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The receiving elements act as intermediary structures between the LED chips and the carrier substrate. These intermediaries provide a controlled interface that enables secure holding during transfer while allowing clean detachment without direct mechanical damage to the chips, mediating between the need for strong holding and gentle release

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If complete detachment of LEDs from substrate is achieved, then mass transfer is enabled, but tilting, shifting or twisting of LEDs may occur

Engineering Contradiction:

Improvemass transfer capabilityVSAvoidpositioning accuracy of LEDs

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The receiving elements are pre-configured on the carrier substrate before LED placement. This preliminary arrangement ensures that when LEDs are transferred and placed, they are immediately captured and positioned correctly by the pre-positioned receiving elements, preventing tilting or shifting during the detachment and transfer process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The receiving elements provide localized holding points at specific positions on the carrier substrate. By concentrating holding functionality at these discrete locations rather than across the entire substrate surface, the LEDs are secured at critical points that prevent tilting and shifting while allowing complete detachment from the main substrate

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12266641B2Multi-chip carrier structure

Publication Date: 2025.04.01 OSRAM OPTO SEMICON GMBH & CO OHG

AI summary

A support structure for receiving planar microchips, comprising a planar support substrate and at least two receiving elements. The receiving elements are connected to the carrier substrate and configured in such a way that they detachably hold a flat microchip between the at least two receiving elements in such a way that the microchip can be moved out with a defined minimum force transversely to a support structure plane.