Multi-Chip Package Spacer for Blocking Interchip Heat Transfer
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Solution Overview
Problem
In multi-chip semiconductor packages, heat transfer from high-power chips to low-power chips can lead to increased junction temperatures, compromising attributes like refresh characteristics, operating speed, and life expectancy.
Innovation Solution
Incorporating a heat transfer blocking spacer made of low thermal conductivity materials like epoxy resin or magnesium carbonate between chips to prevent heat transfer, with varying thickness and shapes such as circular, elliptical, or polygonal, to maintain optimal operating conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple chips are mounted in a single semiconductor package to reduce size and weight, then the package density and integration are improved, but heat transfer from high-power chips to low-power chips increases causing junction temperature to rise
Solution Approach 1:
A spacer is introduced as an intermediary component between the first semiconductor chip and the second semiconductor chip. This spacer acts as a thermal barrier that blocks heat transfer from the high-power first chip to the low-power second chip, while still allowing the chips to be mounted in close proximity within the same package. The spacer material is specifically selected to have low thermal conductivity to achieve this heat blocking function.
2Adaptability or versatility
If chips with different power ratings are mounted adjacent to each other in the same package, then the package functionality and integration are improved, but the low-power chip's operating characteristics deteriorate due to thermal interference
Solution Approach 1:
The spacer serves as a thermal mediator that allows different types of chips with different power ratings to coexist in the same package without thermal interference. By positioning the spacer between the high-power and low-power chips, the package can maintain its functional versatility while protecting the sensitive low-power chip from thermal effects that would compromise its reliability.
3Device complexity
If no heat blocking mechanism is used between chips, then the device complexity is reduced, but heat transfer causes compromised chip attributes such as refresh characteristics, operating speed, and operating life
Solution Approach 1:
The spacer is a simple yet effective intermediary component that provides heat blocking functionality without significantly increasing device complexity. It is a straightforward structural element that can be easily integrated into the existing chip mounting process, providing thermal protection while maintaining operational characteristics such as refresh characteristics, operating speed, and operating life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat transfer blocking spacer effectively limits thermal interference, maintaining stable junction temperatures and preventing overheating, thus ensuring the operational integrity of low-power chips.
Implementation Method 1
a heat transfer blocking spacer interposed between the first semiconductor chip and the second semiconductor chip
Data Source
AI summary
A multi-chip package comprises a semiconductor chip stack structure comprising a semiconductor chip stack including a first semiconductor chip having a first power rating and a second semiconductor chip having a second power rating, the first and second semiconductor chips being stacked one on top of another; and a heat transfer blocking spacer interposed between the first semiconductor chip and the second semiconductor chip.