Multi-Conducting Through Hole Structure for PCB Layout Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional plated through holes (PTHs) on circuit boards occupy a large area, limiting layout density and causing significant electromagnetic coupling and cross-talk issues due to increasing operating frequencies.
Innovation Solution
A multi-conducting through hole structure is introduced, featuring at least two signal lines and one or more reference lines on the inner surface of the through hole, where the reference lines are positioned between the signal lines to shield electromagnetic interference, reducing alternate capacitance and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple signal lines are disposed close together inside a single through hole to reduce the number of through holes and increase layout density, then layout density is improved, but electromagnetic coupling and cross-talk between signal lines increase
Solution Approach 1:
A reference line is introduced as an intermediary element disposed between adjacent signal lines inside the through hole. This reference line acts as a mediator to shield and reduce electromagnetic coupling between signal lines, thereby reducing cross-talk while maintaining the compact multi-conducting structure that improves layout density.
2Reliability
If conventional plated through holes are used to connect circuit layers, then electrical connection is achieved, but the through holes occupy large area and limit layout density
Solution Approach 1:
Multiple conducting lines (signal lines and reference lines) are merged into a single through hole structure. This multi-conducting through hole combines the functions of multiple conventional through holes into one, maintaining reliable electrical connections while significantly reducing the total area occupied and improving layout density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces electromagnetic coupling and cross-talk, enhancing signal transmission quality and layout density by separating signal lines with reference lines, applicable to both single and multiple through holes.
Implementation Method 1
the reference line is disposed between two of the signal lines... effectively reduces electromagnetic coupling and cross-talk... reducing alternate capacitance and inductance
Data Source
AI summary
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a through hole passing therethrough. The signal lines are disposed on a portion of an inner surface of the through hole and extended through the through hole. The reference line is disposed on a portion of the inner surface of the through hole and extended through the through hole, wherein the reference line is disposed between the lines for signal. Because the signal lines are separated by the reference line, the electromagnetic coupling generated by signals can be reduced to lower the cross-talk interference between signals passing through the through hole, so as to promote the signal-transmission quality.