Multi-Cup LED Substrate Reflectivity and Thermal Management
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Solution Overview
Problem
Conventional LEDs face inefficiencies due to heat management issues and light absorption, limiting their brightness and effectiveness in applications like flashlights and general illumination.
Innovation Solution
The development of LED assemblies with machined substrates and transparent solder masks, featuring co-axial cups and non-global solder masks, enhances reflectivity and heat dissipation, reducing light absorption and allowing for increased current usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If higher current is used to increase LED brightness, then illumination intensity is improved, but heat generation increases reducing LED efficiency
Solution Approach 1:
The patent extracts the harmful heat away from the LED die by implementing a dedicated heat sink structure that is thermally coupled to the LED mounting substrate. This separates the light-generating function from the heat-dissipation function, allowing higher currents to be used without thermal degradation.
Solution Approach 2:
The patent converts the harmful heat generated by high-current operation into a manageable thermal flow path. By designing the substrate and heat sink with optimized thermal conduction paths, the heat that would normally reduce efficiency is instead channeled away effectively, enabling the LED to operate at higher currents with maintained efficiency.
2Illumination intensity
If conventional LED structures are used, then manufacturing is simpler, but light absorption by package structures reduces overall light output
Solution Approach 1:
The patent applies local quality by making the solder mask transparent in specific regions where light needs to pass through, while maintaining its electrical insulation function in other areas. This localized modification allows light to escape through the package structure without being absorbed, increasing overall light output while preserving the necessary electrical isolation.
Solution Approach 2:
The patent changes the optical property of the solder mask from opaque to transparent in specific regions. This color/transparency change allows previously absorbed light to now pass through the package structure, converting a light-absorbing element into a light-transmitting element in critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in brighter LEDs with improved light output and color quality, suitable for applications such as flashlights and general illumination, by minimizing heat-related inefficiencies and light loss.
Implementation Method 1
An LED assembly can comprise a transparent solder mask. The transparent solder mask can enhance reflectivity of the substrate (or of material formed upon the substrate).
Implementation Method 2
Light emitting diodes (LEDs) are well known. LEDs are commonly used as indicators on electronic devices.
Implementation Method 3
Heat reduces the efficiency of LEDs. Further, some of the light from an LED is often wasted, e.g., absorbed, by structures of the LED and/or package therefor.
Data Source
AI summary
A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.