Multi-Die Crossbar Switch Layout for Non-Blocking Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing crossbar switches in packaged devices face challenges with inter-die interconnects being overwhelmed by the need to broadcast input signals across multiple semiconductor dice, leading to oversubscription of available inter-die bandwidth.
Innovation Solution
A non-blocking crossbar switch architecture is implemented across multiple semiconductor dice, with a plurality of interleaved crossbar switch segments, each handling a portion of the input and output ports, thereby distributing the interconnect burden and preserving the non-blocking property.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a non-blocking crossbar switch is implemented across multiple semiconductor dice with broadcasting architecture, then the non-blocking property is achieved, but the inter-die bandwidth is oversubscribed
Solution Approach 1:
The crossbar switch is divided into multiple independent switch segments distributed across different semiconductor dice. Each segment handles a subset of input-output port connections, eliminating the need for full broadcasting across all dice. This segmentation maintains the non-blocking property while reducing inter-die bandwidth requirements by limiting communication to local segments.
Solution Approach 2:
Interleavers and de-interleavers are introduced as intermediary components that route data between switch segments on different dice. These intermediaries enable efficient data distribution without requiring each die to broadcast to all others, thus preserving non-blocking functionality while optimizing inter-die bandwidth utilization.
2Adaptability or versatility
If a large crossbar switch is implemented on a single semiconductor die, then the non-blocking property is maintained, but manufacturing yield and cost are degraded
Solution Approach 1:
The crossbar switch functionality is segmented into multiple smaller switch segments, each implemented on separate semiconductor dice. This division reduces the complexity and size of individual dies, improving manufacturing yield and reducing costs while collectively providing the full non-blocking crossbar switch capability across the multi-die package.
3Ease of manufacture
If crossbar switch segments are distributed across multiple semiconductor dice, then manufacturing yield is improved, but inter-die interconnect complexity increases
Solution Approach 1:
Interleavers and de-interleavers serve as intermediary components that simplify the inter-die interconnect architecture. By introducing these intermediaries, the system manages data distribution between switch segments in an organized manner, reducing the complexity of direct inter-die routing while maintaining efficient communication pathways.
Solution Approach 2:
The system introduces a new dimension of organization by implementing interleavers and de-interleavers as separate functional layers between the switch segments and external interfaces. This dimensional organization separates the complexity of inter-die communication from the switch fabric itself, making the overall system more manageable.
Data Source
AI summary
A non-blocking crossbar switch architecture circumvents the problem present in prior art crossbar switches where input signals may oversubscribe the available inter-die bandwidth. The new non-blocking crossbar switch architecture is split across a plurality of semiconductor dice, including a plurality of interleaved crossbar switch segments. Only one crossbar switch segment is implemented on each semiconductor die. A plurality of input ports and output ports are coupled to the crossbar switch. The crossbar switch is non-blocking, i.e., any one output port not currently receiving data may receive data from any one input port.