Electric Digital Data Processing TRIZ Cases

See how a kitchen machine identifies food-processing modules via electrical connector signal ex

A single rotation information pin distinguishes analog commands from noise, enabling master-slave motor drivers to share one chip design.

Adjustable pull-up and pull-down resistors stabilize idle two-wire bus voltages, preventing undefined inputs and reflections.

Measuring shared bus impedance lets an autonomous vehicle interface identify transmitting ECUs and cut integration time with proprietary vehicle systems.

Bus impedance sensing lets an autonomous vehicle interface identify transmitting ECUs on a shared CAN bus, cutting integration time and cost.

Automated virtual DCS deployment uses topology-based setup and I/O simulation to test control logic faster, with fewer errors and lower cost.

Specialized main and branch terminals let more I/O units be linked in one station, avoiding extra stations, cables, and connection points.

Selectable terminal paths let one I/O unit link multiple slave circuits to multiple master circuits without extra stations or cables.

Separate bus-specific setting screens clarify dual-sided CPU unit configurations and reduce function-setting errors across different bus standards.

Partial reconfiguration splits a fieldbus interface into static and dynamic portions, enabling faster protocol changes with hardware reuse.

Automatic daisy-chain bridging keeps automation I/O communication running during module unplugging and exchange without reset or power down.

A control unit compares PIO and DMA transfer times for communication data, then selects the faster, more consistent path.

Automatic address assignment from connection position cuts motor starter setup time while preserving bus communication timeliness.

Sensed ground current and compensated supply voltages help bus receivers and transmitters maintain accurate data sampling under high current.

Multiple input and output connectors create redundant cable paths between PLC expansion base units, preventing communication loss from cable faults.

Independent calibration memory on each extension module enables ADC sharing on the main module, cutting cost and avoiding recalibration after swaps.

A buffered, asynchronous PLC architecture collects scan-period data without blocking control cycles, preserving monitoring completeness and work efficiency.

A signal converter bridges incompatible CNC and servo bus interfaces by extracting working parameters and remapping them to the target protocol.

Conditional transmission plus continuity flags lets a receiver detect uninterrupted or interrupted processing without sending every data item.

Current-based voltage compensation offsets USB-C cable resistance, improving 5V/3A delivery reliability without thicker or costlier cables.

Removable I/O segments and socketed power/data contacts let block I/O modules be reconfigured on site with less wiring and downtime.

A memory dongle preserves appliance personality settings and service history, enabling correct replacement board setup without manual selection.

Automatic daisy-chain bridging keeps I/O-bus communication alive during module removal, avoiding reset and power-down.

A fuse adapter short-circuit pulls one MCU GPIO low after power-on, letting twin CMUs assign distinct CAN addresses without extra boards.

Vertical tiling of compute and programmable logic dies boosts bandwidth and cuts edge-interface congestion, latency, and timing limits.

Coarse and fine SPI clock delay calibration matches round-trip timing to improve response sampling accuracy and reduce processor waste.

A universal bus interface lets one bus controller address interchangeable PLD modules, reducing interconnect complexity and reuse costs.

Round-trip delay calibration shifts the SPI clock to match response timing, reducing line-noise sampling and missed data.

A universal bus interface and sequence-driven controller let modular PLD memory blocks scale across applications without complex interconnections.

Feedback sampling and delay calibration keep phase accuracy across 200 MHz to 6.4 GHz while lowering SERDES clock power.

Direction-based level shifting lets LPC serial interrupts safely pass between low-voltage hosts and higher-voltage external devices.

Configuration bits travel on the same interposer wires as data to set repeater direction, cutting wire count, power use, and routing cost.

Up/down level shifters carry USB 2.0 signals with DC components across isolated power domains despite ground voltage differences.

Sequential logic-level control lets daisy-chained bus devices self-assign unique identifiers without selection circuits or physical switches.

Phase-shifted oversampling and differential comparators let an FPGA handle USB 2.0 high-speed data without a CDR circuit.

Interleaved switch segments across multiple dice avoid inter-die bandwidth oversubscription while preserving non-blocking throughput.

Priority-based pointer resets clear residual FIFO data at scan start, interruption, and restart to keep A/D conversion processing fast.

Bi-directional start/done control and sleep-mode sensor ICs enable fast serial array readout with lower power, cost, and clock jitter.

Transition-dependent boost drivers improve PAM4 eye opening and signal integrity in high-speed memory interfaces beyond NRZ limits.

Oversampling with phase-shifted clocks lets an FPGA handle 480 Mbps USB 2.0 data without a CDR circuit, reducing interface complexity.

Embedded ASIC-based hard cores give FPGAs faster long-distance data paths, cutting routing delay and easing place-and-route pressure.

Embedded ASIC hard cores and local stations shorten FPGA data paths, reducing routing delay and improving inter-module communication speed.

Directional transmitter control and delay elements simplify SIM level shifting, cut latency, and prevent positive data feedback.

By lowering packet amplitude after threshold exceedance, this circuit avoids false USB disconnect detection caused by noise and attenuation compensation.

A split programmable IC and companion die use a SiP bridge with data aggregation to keep high bandwidth while lowering die area and cost.

Common-polarity initialization signals keep one-hot multiplexers stable at power-up, then hand off cleanly to normal interconnect operation.

A split iNOC and eNOC architecture moves high-speed data off FPGA user logic to cut congestion and improve latency for PCIe and GDDR6 access.

ASIC-based hard cores with stations and a high-speed exchange unit bypass cascaded FPGA routing to reduce delay and raise operating frequency.

A voltage-divider and comparator interface lets one station connector accept variable-voltage and open-collector key injectors without damage.

Detects CAN FD traffic and isolates TXD/RXD paths so legacy CAN nodes can coexist at runtime without ECU hardware or software upgrades.

Charge sharing between complementary data buses creates mid-range voltages that cut DRAM bus power without slowing data access.

Multipacket I/O scheduling, deferred requests, and transfer maps cut secondary storage latency and keep CPUs from idling.

Remote GPUs, FPGAs, and ASICs are emulated as local PCIe devices, improving data center resource utilization while reducing server sprawl.

RPUs translate NVLink and CHI messages so ARM-based accelerators can share coherent system memory beyond local device capacity.

A scalar processor predicts shared scale values for vector block quantization, cutting error and memory cost with small registers.

An FPGA identifies PCIe interrupt type from vector signals and switches processing paths to avoid logic rewrites during processor upgrades.

A PCI engine tracks slot usage on worker nodes and publishes allocability to the scheduler, improving GPU and hardware placement.

A port mode controller resets the second PCIe link during mode changes to prevent unintended link downs and keep dual-port SSD communication stable.

A processing unit selectively couples to one memory data bus to cut die area and implementation cost while preserving in-memory data handling flexibility.

Independent pseudo-split dies and external multiplexing cut DIMM wiring complexity while removing rank-switching idle cycles and CA interleaving.

A shared data bus carries both calculation and reconfiguration data in timed cycles, cutting wiring overhead and reconfiguration time.

A timing-adaptive BCOM protocol separates pseudo-channel commands to support burst on the fly, multiple ranks, and compatibility.

Separate DMA channel arbitration, QoS priorities, and buffer timestamps keep peripheral transfers on time despite latency uncertainty.

Buffered request batching lets a storage controller delay stream accesses for sequential page handling, cutting page churn, power use, and bandwidth waste.

Storing prior command lengths lets SD and microSD controllers avoid stop-transmission cleanup and raise random IOPS.

Intermediate I2C transmission chips return immediate feedback while storing downstream status, keeping the interface active for larger long-distance data packets.

An LTSSM-aware link controller selects higher or lower speeds by configuration-state entry, balancing efficiency and error reduction.

A dual-bus semiconductor bridge passes data between different protocols and reduces transceiver and interconnect complexity.

Uneven channel loads delay multi-core memory requests; adaptive queue arbitration balances routing and improves throughput.

A modular link layer converts memory-controller signals into D2D packets, expanding HBM bandwidth without enlarging the compute die.

Fixed FPGA circuits limit I2S device coverage; configurable UVM parameters simulate varied roles, data lengths, and sampling rates.

A split interface handles command and data packets across protocols to expand processing capacity and reduce bandwidth constraints.

Reconfigurable virtual-to-physical bindings adapt CXL protocols and addresses, enabling any-to-any connectivity across the switch fabric.

Mapping M-PHY signals to PCI connectors resolves speed and compatibility trade-offs.

Firmware programs distinct addresses on physical ports to present a single SAS expander chip as multiple virtual expanders.

A DRAM circuit integrates processors managed via a control interface that coordinates memory access and refresh operations.

A data transfer device uses a band-smoothing unit to delay notification signals for controlled read timing.

A network chip manager categorizes interrupts into service levels to control propagation timing for processing elements.

A display device manages Hot Plug Detect signals through an auxiliary channel with specific resistor configurations to ensure proper voltage levels.