Multi-Die IC Heat Sink Coupling for Thermal Management
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Solution Overview
Problem
Multi-die integrated circuits face challenges in heat dissipation due to increased heat generation and complex architectural features, which can lead to reduced performance and material stress as temperature increases.
Innovation Solution
A multi-die IC structure incorporating a heat sink coupled to each die through solder bumps or thermally conductive adhesive, with thermal wires and a fan or micro-machine fan for enhanced heat dissipation, and a package that integrates the heat sink as a top portion, facilitating efficient heat transfer and distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple dies are placed within a single package to increase integration, then communication speed and functionality are improved, but heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments by coupling each die individually to the heat sink, rather than treating the multi-die package as a single thermal unit. This segmentation allows for targeted heat removal from each die, improving overall thermal management efficiency while maintaining the high-speed communication benefits of the multi-die architecture.
Solution Approach 2:
The patent introduces a heat sink as an intermediary thermal management component between the multiple heat-generating dies and the external environment. This intermediary structure provides a dedicated thermal pathway that separates the thermal management function from the electrical interconnection function, allowing high-speed communication while effectively dissipating heat from each die through individual coupling mechanisms.
2Adaptability or versatility
If multiple dies are integrated into a single package, then system functionality is enhanced, but heat dissipation regulation becomes difficult due to architectural complexity
Solution Approach 1:
The patent creates a universal heat sink structure that can simultaneously serve multiple dies with different thermal requirements. The heat sink is designed with multiple coupling surfaces and can accommodate various attachment methods (solder bumps, thermally conductive adhesive) to provide a universal thermal management solution that simplifies the complexity of regulating heat dissipation across multiple diverse dies while maintaining enhanced system functionality.
3Productivity
If increased number of dies are used to improve performance, then computational capability increases, but stress within the IC structure increases due to thermal expansion
Solution Approach 1:
The patent converts the harmful thermal stress generated by multiple high-performance dies into a beneficial controlled thermal management system. By introducing the heat sink with multiple coupling mechanisms, the thermal expansion stresses are managed and distributed across the heat sink structure rather than being concentrated within the IC package, thereby allowing high computational capability while reducing material stress through controlled thermal pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation, maintaining uniform operating temperatures and reducing stress within the IC structure, thereby improving performance and reliability.
Implementation Method 1
A multi-die IC structure with a heat sink... heat sink coupled to the first surface of the first die and the first surface of the second die
Implementation Method 2
a fan coupled to the heat sink... The fan can be coupled to a power source
Data Source
AI summary
An integrated circuit structure can include a first die including a first surface and a second surface and a second die including a first surface and a second surface. The first surface of the first die can be coupled to the second surface of the second die. The integrated circuit structure also can include a heat sink coupled to the first surface of the first die and the first surface of the second die.