Multi-Die Active Termination Control Without Manual MRS Setting

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Solution Overview

Problem

In multiple die package structures with semiconductor devices using power supply voltage termination, it is challenging to independently control the active termination operation of each device, as the enable or disable state of the operation signal is not sufficient to turn off the active termination circuit, requiring manual setting of termination codes in the mode register set (MRS) for each device, which complicates system performance and efficiency.

Innovation Solution

An integrated circuit with a multiple die package structure that includes active termination circuits, multiple die package information transfer units, and compulsory termination units, which allow for independent control of active termination operations by converting setting codes into disable states based on multiple die package information signals, enabling or disabling the active termination circuits accordingly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If manual setting of termination codes in MRS is used to turn off active termination circuit in each device, then active termination can be turned off, but system complexity and control difficulty increase

Engineering Contradiction:

Improveactive termination controlVSAvoidcontrol process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

A multiple die package information transfer unit is introduced as an intermediary component that automatically transfers package identification information to each semiconductor device. This mediator eliminates the need for manual MRS configuration by automatically setting the active termination control based on the detected package type, thereby reducing control complexity while maintaining reliable termination management.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

Each semiconductor device is equipped with a compulsory termination unit that automatically configures its own active termination setting based on the received multiple die package information signal. The device self-adjusts its termination state without external intervention or manual MRS programming, enabling autonomous adaptation to the package configuration.

Inventive Principle:

Principle #25Self-service

2Use of energy by moving object

If operation signal is disabled to turn off active termination, then current consumption is reduced, but termination codes in MRS still need to be manually set to '0'

Engineering Contradiction:

Improvecurrent consumptionVSAvoidtermination control operation

Core Design Contradiction:

Use of energy by moving objectVSEase of operation

Solution Approach 1:

The multiple die package information transfer unit performs preliminary action by pre-configuring the active termination control settings before the device operates. The package type is identified and the appropriate termination state is pre-established through automatic signal transfer, eliminating the need for subsequent manual MRS programming and enabling immediate energy-efficient operation.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The manual mechanical process of setting MRS codes is replaced by an automated electronic signal transfer mechanism. The multiple die package information signal automatically triggers the compulsory termination unit to configure the appropriate termination state, substituting manual operation with electronic automation and significantly improving ease of operation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If external resistor is used for termination, then signal reflection is minimized, but system board space is occupied

Engineering Contradiction:

Improvesignal transmission qualityVSAvoidsystem board space

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The termination function is extracted from the external system board level and integrated directly into the semiconductor device itself. By incorporating the active termination circuit within the device, the need for external resistors on the system board is eliminated, maintaining signal transmission quality while freeing up board space for other components.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The termination circuit is merged with the semiconductor device, combining the signal processing function and termination function into a single integrated unit. This consolidation eliminates the need for separate external termination components, reducing system board space while maintaining reliable signal transmission through the integrated active termination control.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS8896342B2Integrated circuit and operation method thereof

Publication Date: 2014.11.25 MIMIRIP LLC

AI summary

An integrated circuit of a multiple die package structure having a plurality of semiconductor devices, each of the plurality of semiconductor devices may include an active termination circuit configured to perform an active termination operation to the semiconductor device, and to be turned off in a disable state of an active termination setting code, a multiple die package information transfer unit configured to transfer a multiple die package information signal, and a compulsory termination unit configured to selectively convert the active termination setting code into the disable state in response to the multiple die package information signal.