Multiple-Junction LED Chip Bonding for Color Gamut and Series Wiring
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Solution Overview
Problem
Existing LED technologies face challenges in producing high-quality light with desired emission characteristics while maintaining high light emission efficiency, particularly in applications where multiple LED chips with different emission colors need to be closely packed and electrically connected.
Innovation Solution
The development of multiple junction light-emitting diode (LED) chips, where multiple active LED structures are bonded together with bonding layers of sufficient thickness to maintain mechanical integrity. These bonding layers can be made of electrically insulating materials with conductive vias to provide electrical paths between the active LED structures, allowing for series connection and efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple LED chips with different emission colors are arranged in close proximity on a common submount, then the color gamut and emission characteristics are improved, but the complexity of electrical connections increases
Solution Approach 1:
Multiple LED chips with different emission colors are integrated onto a single common submount, merging multiple light sources into one unified device. This combining approach improves color gamut while the shared submount infrastructure reduces overall electrical connection complexity compared to separate packaged LEDs.
Solution Approach 2:
The common submount serves multiple functions: mechanical support for multiple LED chips, electrical connection infrastructure, and thermal management platform. This multi-functionality reduces the need for separate components and simplifies the overall electrical connection architecture.
2Stability of the object's composition
If bonding layers are made thicker to maintain mechanical integrity, then the mechanical stability is improved, but the device volume increases
Solution Approach 1:
The bonding layer thickness is optimized to a specific range (100-5000 nm) that provides sufficient mechanical integrity while minimizing volume increase. This parameter optimization balances mechanical stability requirements with compact device design constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of LED chips with enhanced mechanical stability and efficient electrical connectivity, allowing for improved light emission characteristics, increased brightness, and broader color gamut within a smaller footprint, addressing the challenges of packing multiple LED chips with different emission colors.
Implementation Method 1
bonding layers are provided between active LED structures with sufficient thicknesses to maintain mechanical integrity within the LED chip
Implementation Method 2
Bonding layers may be formed of electrically insulating materials with electrically conductive vias formed therethrough to provide electrically conductive paths between active LED structures
Implementation Method 3
When a bias is applied across the doped layers, holes and electrons are injected into the one or more active layers where they recombine to generate emissions such as visible light or ultraviolet emissions
Data Source
AI summary
Semiconductor devices and more particularly multiple junction light-emitting diode (LED) chips and related methods are disclosed. LED chips include multiple active LED structures that are bonded together. The active LED structures may be vertically bonded within the LED chip. Bonding layers are provided between active LED structures with sufficient thicknesses to maintain mechanical integrity within the LED chip. Bonding layers may be formed of electrically insulating materials with electrically conductive vias formed therethrough to provide electrically conductive paths between active LED structures. Active LED structures may be connected in series for high voltage applications. Emissions from the active LED structures may have same emission colors, multiple distinct emission colors, and/or variations in peak wavelengths within a same color range.