Synchronous Multi-Laser Glass Separation With Annular IR Heating

The patent replaces conventional mechanical cutting methods with a laser-based processing system. A pulsed laser beam creates defects along a contour line within the glass substrate, and an infrared laser beam induces thermal stresses to separate the glass along this line. This optical-based approach eliminates mechanical contact, thereby preventing debris generation and subsurface damage while significantly increasing separation speed.

The patent utilizes thermal phase transitions in the glass material. The infrared laser beam heats the glass substrate along the defect line, inducing thermal expansion and stress that propagates the separation. The rapid heating and cooling cycles create controlled thermal shocks that facilitate clean separation without mechanical force, thus avoiding debris and damage.

The patent employs continuous laser scanning to create defects along the entire contour line in a single pass. The pulsed laser beam continuously moves along the desired separation path, forming defects throughout the glass substrate simultaneously. This continuous action eliminates the need for multiple processing steps or sequential operations, dramatically reducing processing time and improving productivity.

The patent uses periodic pulsed laser beams to create defects at regular intervals along the contour line. The pulsed nature of the laser allows for rapid successive defect formation as the beam scans through the material. This periodic action enables fast processing while maintaining precise control over defect distribution and separation quality.

The patent incorporates feedback mechanisms through the laser control system that monitors and adjusts the laser parameters during processing. The system can detect variations in material properties or processing conditions and automatically compensates to maintain consistent defect formation and separation quality. This feedback control ensures high repeatability and reliability across multiple processing runs.

By replacing mechanical cutting with laser-based defect formation and thermal separation, the patent eliminates variability associated with mechanical tool wear, positioning errors, and operator skill differences. The laser system provides consistent, programmable parameters that ensure uniform defect creation and separation behavior, thereby improving both precision and repeatability.