Multi-Layer Dam LED Package Structure for Enhanced Light Emission
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Solution Overview
Problem
Conventional LED package structures are limited by their single-layer dam design, which restricts their height and performance, leading to inefficient use of space and material.
Innovation Solution
A multi-layer surrounding dam is introduced, where a second wall is stacked upon a first wall to create a ring-shaped structure with a die-bonding region, allowing for a larger light emitting area and reduced material usage, with specific dimensions and arrangements of LED chips and encapsulating colloid to enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-layer dam is used to form the LED package structure, then the structure is simple to manufacture, but the light emitting area is limited and the height is constrained
Solution Approach 1:
The dam structure is segmented into multiple layers (first dam layer, second dam layer, third dam layer) with each layer having specific functions. The first dam layer provides structural support, the second dam layer expands the light emitting area, and the third dam layer provides encapsulation. This segmentation allows the structure to achieve both manufacturing simplicity and increased light emitting area.
Solution Approach 2:
The patent transitions from a single-layer (2D) dam structure to a multi-layer (3D) dam structure. By adding vertical dimensionality with multiple dam layers at different heights, the design achieves increased light emitting area and structural complexity while maintaining manufacturing feasibility through sequential layer formation processes.
2Device complexity
If a single-layer dam is used, then the manufacturing process is simple, but the height of the structure is limited
Solution Approach 1:
The dam is divided into three distinct layers with different heights and functions. The first dam layer has height H1, the second dam layer has height H2, and the third dam layer has height H3. This segmentation enables the structure to achieve greater overall height while maintaining manageable complexity through modular layer design.
Solution Approach 2:
By introducing vertical layering, the patent transforms the structure from a single-plane configuration to a multi-level three-dimensional structure. This dimensional change allows the height parameter to be increased by stacking functional layers vertically rather than expanding horizontally, thus achieving greater height without proportionally increasing the footprint.
3Length of stationary object
If a single-layer dam with large width is used to achieve specific height, then the height requirement is met, but material usage increases
Solution Approach 1:
The multi-layer dam structure segments the material distribution vertically. Each layer uses material only where needed for its specific function, avoiding the excessive material usage of a single wide layer. The first dam layer uses material for structural base, the second layer adds material only for light emitting area expansion, and the third layer uses material for encapsulation, optimizing overall material efficiency.
Solution Approach 2:
The patent solves the material efficiency problem by transitioning from horizontal material distribution (single wide layer) to vertical material distribution (multiple stacked layers). This dimensional change allows the structure to achieve the required height with less total material by stacking thinner layers vertically rather than using a single thick horizontal layer, thus reducing material usage while meeting height requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layer dam configuration increases the light emitting area, reduces material costs, ensures even encapsulating colloid surfaces, and improves lighting performance by uniform chip distribution and phosphor excitation.
Implementation Method 1
The encapsulating colloid is filled within the accommodating space, and the LED chips are embedded in the encapsulating colloid
Data Source
AI summary
An LED package structure and a carrier thereof are provided. The LED package structure includes a carrier, a plurality of LED chips, and an encapsulating colloid. The carrier includes a substrate, a ring-shaped first wall disposed on the substrate, and a ring-shaped second wall stacked on the first wall. A portion of the substrate surrounded by the first wall is defined as a die-bonding region, and the first wall, the second wall, and the die-bonding region jointly define an accommodating space. The LED chips are mounted on the die-bonding region and are arranged in the accommodating space. The encapsulating colloid is filled within the accommodating space, and the LED chips are embedded in the encapsulating colloid.