Multi-layer Full Dense Mesh Power Distribution Network
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Solution Overview
Problem
Semiconductor devices face challenges in achieving consistent power distribution and reducing propagation delay and decoupling response times, particularly in distributing multiple power signals and signals other than power signals.
Innovation Solution
A multi-layer full dense mesh (MFDM) structure with three metal layers, including a metal-top layer, a metal-top-1 layer, and a metal-top-2 layer, interconnected by vertical interlayer connections and dielectric material layers, which allows for the distribution of multiple power signals and other signals through bump pad arrays and zipper channels, and incorporates metal-insulator-metal capacitors for decoupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layer full dense mesh structure with three metal layers is used to distribute multiple power signals, then power distribution consistency and decoupling response time are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent transitions from a single-layer power distribution network to a multi-layer full dense mesh structure with three metal layers (metal-top, metal-top-1, metal-top-2). This dimensional expansion allows power signals to be distributed across multiple layers simultaneously, improving power distribution consistency and providing multiple decoupling paths for faster response times.
Solution Approach 2:
The power distribution network is segmented into distinct functional regions on each metal layer: bump pads for external connections, zipper channels for signal routing, and decoupling capacitor regions for power stabilization. This segmentation allows each region to be optimized independently while working together as an integrated system.
2Productivity
If multiple power signals and other signals are distributed through bump pad arrays and zipper channels, then signal distribution efficiency is improved, but propagation delay increases
Solution Approach 1:
The patent utilizes three stacked metal layers to create a three-dimensional power and signal distribution network. This allows signals to be distributed in parallel across multiple layers, effectively reducing the path length and propagation delay while maintaining high distribution efficiency through the dense mesh configuration.
Solution Approach 2:
Vertical interlayer connections serve as intermediaries that efficiently transfer power and signal between the three metal layers. These connections enable rapid signal routing and reduce propagation delay by providing direct vertical pathways rather than requiring lateral routing through the substrate.
3Reliability
If metal-insulator-metal capacitors are incorporated for decoupling, then decoupling response time is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent combines the decoupling capacitor structure with the existing multi-layer metal network by forming metal-insulator-metal capacitors that utilize the metal-top-1 and metal-top-2 layers. This integration allows decoupling functionality to be incorporated into the power distribution structure itself, reducing response time while avoiding the need for separate capacitor components.
Solution Approach 2:
The decoupling capacitors are formed using the same fabrication processes and materials as the surrounding interconnect structure. The metal layers and dielectric materials already present in the device are utilized to create the capacitor structures, allowing the device to provide its own decoupling functionality without requiring additional specialized manufacturing steps.
Data Source
AI summary
A multi-layer full dense mesh (MFDM) device. The MFDM may include a metal-top layer including a bump pad array that may include a power1 (PWR1) bump pad within a PWR1 bump region, a VSS bump pad within a VSS bump region, and a power2 (PWR2) bump pad within a PWR2 bump region. The metal-top layer may also include a PWR1 majority metal-top region. The MFDM may also include a metal-top-1 layer beneath the metal-top layer and including a VSS majority metal-top-1 region, a PWR1 metal-top-1 region, and a PWR2 metal-top-1 region. The MFDM may also include a metal-top-2 layer beneath the metal-top-1 layer and including a PWR2 majority metal-top-2 region, a VSS metal-top-2 region, and a PWR1 metal-top-2 region. The MFDM may also include top-1 VIAs disposed between the metal-top layer and the metal-top-1 layer, and top-2 VIAs disposed between the metal-top-1 layer and the metal-top-2 layer.