Multi-Layer Hard Mask for Magnetic Write Pole Patterning
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Solution Overview
Problem
Current magnetic write heads face challenges in reducing the track width of the write pole to increase data density while maintaining accurate definition of the write pole surfaces.
Innovation Solution
A method using a multi-layer hard mask structure, comprising a spun-on Si-containing material as a bottom anti-reflective coating and a sputter-deposited material with good reactive ion etching selectivity, to pattern a magnetic write pole with a narrow track width and tight critical dimension control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the track width of the write pole is reduced to increase data density, then data density is improved, but the definition and control of the write pole surfaces deteriorate
Solution Approach 1:
The patent divides the mask structure into multiple layers: a first hard mask layer (spin-on Si-containing material) and a second hard mask layer (sputter-deposited material). This segmentation allows each layer to perform its specialized function - the first layer provides optical properties for patterning, while the second layer provides etch selectivity and surface definition, thereby maintaining manufacturing precision even as track width is reduced to increase data density.
Solution Approach 2:
The patent employs a composite multi-layer mask structure combining materials with different properties. The spin-on Si-containing material provides optical characteristics suitable for photolithography, while the sputter-deposited material provides superior reactive ion etching selectivity. This composite approach enables precise control of write pole surfaces at reduced track widths, resolving the contradiction between increasing data density and maintaining manufacturing precision.
2Device complexity
If a single hard mask material is used, then the process is simpler, but the optical properties and etching selectivity cannot be optimized simultaneously
Solution Approach 1:
The mask structure is segmented into two distinct layers, each optimized for its specific function. The first layer (spin-on Si-containing material) is optimized for optical properties during photolithography, while the second layer (sputter-deposited material) is optimized for reactive ion etching selectivity. This segmentation enables simultaneous optimization of both optical properties and etching performance without excessive complexity.
Solution Approach 2:
Each layer of the mask structure is designed with local quality - the first layer has properties optimized for optical interaction during patterning, while the second layer has properties optimized for etching resistance and selectivity. This local optimization of material properties in different layers achieves superior critical dimension control while maintaining reasonable process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of a well-defined magnetic write pole with a very narrow track width, enhancing data density and write speed by maintaining precise control over the write pole's dimensions and reducing contamination risks.
Implementation Method 1
The first hard mask layer has optical properties that allow it to function well as a bottom anti-reflective coating (BARC)
Implementation Method 2
a second hard mask material that is deposited by a deposition process such as sputter deposition
Implementation Method 3
The second hard mask material has good selectivity for reactive ion etching so that it functions well as a RIE hard mask
Data Source
AI summary
A method for manufacturing a magnetic write pole using a mask that includes a multi-layer hard mask. The multi-layer hard mask hard mask includes a first hard mask layer that is constructed of a Si containing material that can be spun on and a second hard mask material that is deposited by a deposition process such as sputter deposition. The first hard mask layer has optical properties that allow it to function well as a bottom anti-reflective coating (BARC) and also has optical properties that match well with an underlying image transfer layer. The second hard mask material has good selectivity for reactive ion etching so that it functions well as a RIE hard mask.