Multi-Layer Mold Injection Tool for Semiconductor Die Encapsulation
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Solution Overview
Problem
Current transfer molding processes for encapsulating semiconductor dies on lead frame strips are limited by the number of molding cavities in the tool, which increases costs and processing time, and the time required for the encapsulant material to harden, reducing throughput.
Innovation Solution
A mold injection tool with two interlocking mold plates, each with columns of cavities and channel sections that guide liquefied molding material into adjacent cavities, allowing for simultaneous encapsulation of multiple lead frame strips without increasing the time for the material to harden, thereby doubling the throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of molding cavities is increased to accommodate more semiconductor dies, then the throughput is improved, but the size and cost of the molding tool increases
Solution Approach 1:
The patent transitions from a single-layer arrangement of mold cavities to a multi-layer three-dimensional configuration. Mold cavities are arranged in multiple layers stacked vertically, allowing the molding tool to accommodate more semiconductor dies without increasing the horizontal footprint. This vertical stacking enables higher throughput while maintaining a compact tool size.
2Productivity
If more unit lead frames are molded simultaneously to increase throughput, then the productivity is improved, but the processing time for material hardening remains the same
Solution Approach 1:
The patent implements multi-layer stacking of mold cavities in the vertical dimension, enabling simultaneous molding of multiple unit lead frames across different layers. The liquefied molding material is injected to fill cavities in all layers concurrently, and all cavities harden simultaneously during the same processing time cycle. This vertical arrangement allows throughput to scale with the number of layers without extending the processing time.
3Productivity
If the molding tool size is increased to accommodate more molding cavities, then the number of semiconductor dies that can be molded simultaneously increases, but the cost of the molding process increases
Solution Approach 1:
The patent utilizes vertical stacking of mold cavities in multiple layers, allowing a compact molding tool to accommodate a large number of semiconductor dies. This three-dimensional arrangement maximizes the use of vertical space, enabling high throughput without requiring a large horizontal footprint. The compact tool design reduces manufacturing costs and facility requirements compared to traditional single-layer horizontal expansion approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tool efficiently encapsulates twice the number of semiconductor dies in a single molding process without extending the material hardening time, enhancing processing efficiency and reducing costs by maximizing the use of available space.
Implementation Method 1
The liquefied encapsulant material is injected into a cavity that surrounds the semiconductor die (or dies) on each unit lead frame. The liquefied encapsulant material is then hardened into a solid state
Data Source
AI summary
A mold injection tool includes a first mold plate having first and second columns of mold cavities, each of the cavities and a first cull block arranged between the first and second columns. A plurality of first channel sections is formed between an adjacent pair of mold cavities. Each of the first channel sections are configured to guide liquefied molding material from the first cull block into the adjacent pair of mold cavities in the first and second columns. The mold injection tool further includes a second mold plate having similarly configured mold cavities, cull block, and channel section. Adjacent ones of the first and second channel sections form a contained chamber when the first and second mold plates are pressed together. The mold plates are configured to inject liquefied molding material through an entrance that is in open communication with each contained chamber.