Multi-Memory Die Packaging for Heat Dissipation and Power Access
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Solution Overview
Problem
Existing semiconductor chip packaging technologies face challenges in balancing cost, heat dissipation, and access to power (VDD) and ground, while also maintaining interconnectivity among semiconductor dies, often resulting in suboptimal performance in these areas.
Innovation Solution
A packaging arrangement that includes a substrate with a multi-memory die, comprising multiple individual memory dies still physically connected, and a semiconductor die configured as a system on a chip (SOC), where the memory dies are attached to the substrate using epoxy or glue, and connected via wire bonds or solder balls for improved heat dissipation and VDD/ground access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple individual memory dies are kept physically connected together as a multi-memory die, then heat dissipation and access to VDD/ground are improved, but device complexity increases
Solution Approach 1:
Multiple individual memory dies are kept physically connected together to form a multi-memory die structure, merging their thermal and electrical pathways to improve heat dissipation and VDD/ground access efficiency
Solution Approach 2:
The multi-memory die is created by singulating the wafer into memory dies that remain physically connected, segmenting the die into functional units while maintaining structural integration for thermal and electrical management
2Ease of manufacture
If semiconductor dies are arranged in traditional packaging, then manufacturing cost is controlled, but heat dissipation and access to VDD/ground are suboptimal
Solution Approach 1:
The patent transitions from traditional two-dimensional packaging arrangements to a three-dimensional multi-memory die structure, enabling improved heat dissipation and electrical access while maintaining manufacturing feasibility through wafer-level processing
3Ease of manufacture
If semiconductor dies are arranged in traditional packaging, then manufacturing cost is controlled, but access to VDD and ground is suboptimal
Solution Approach 1:
Multiple memory dies are physically connected to share common VDD and ground pathways, improving electrical access efficiency while maintaining cost-effective manufacturing through integrated wafer-level construction
Data Source
AI summary
In an embodiment, there is provided a packaging arrangement comprising a substrate; a multi-memory die coupled to the substrate, wherein the multi-memory die comprises multiple individual memory dies, and each of the multiple individual memory dies is defined as an individual memory die within a wafer of semiconductor material during production of memory dies, and the multi-memory die is created by singulating the wafer of semiconductor material into memory dies, where at least one of the memory dies is the multi-memory die that includes the multiple individual memory dies that are still physically connected together; and a semiconductor die coupled to the multi-memory die and the substrate, wherein the semiconductor die is configured as a system on a chip, wherein at least one of the multi-memory die and the semiconductor die is attached to the substrate.