Multi-nozzle HF Cleaning for Substrate Processing Chamber
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Solution Overview
Problem
The existing cleaning methods for substrate processing apparatuses are inefficient in cleaning the entire process chamber, particularly the vicinity of the substrate unloading area, leading to increased cleaning time due to residual reaction by-products, which require manual intervention or prolonged gas cleaning.
Innovation Solution
A cleaning method involving a hydrogen fluoride gas supply system that targets both the reaction tube and the manifold, utilizing multiple nozzles to ensure thorough cleaning of the process chamber, including the inner walls and areas around the substrate unloading region, thereby reducing cleaning time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single nozzle supplies cleaning gas toward the substrate, then the substrate area is cleaned, but the vicinity of the substrate unloading area and other portions remain uncleaned with residual reaction by-products
Solution Approach 1:
The cleaning system is segmented into multiple nozzles (first nozzle, second nozzle, third nozzle) positioned at different locations within the process chamber. Each nozzle targets specific areas: the first nozzle cleans the substrate area, the second nozzle cleans the reaction tube interior, and the third nozzle cleans the manifold inner wall surface. This segmentation enables comprehensive coverage of all areas including previously difficult-to-reach zones, thereby improving cleaning coverage without extending cleaning time
Solution Approach 2:
The patent introduces a multi-nozzle cleaning gas supply system as an intermediary mechanism to deliver cleaning gas to multiple locations simultaneously. The nozzles are strategically positioned to create targeted gas flows that reach the substrate area, reaction tube interior, and manifold inner wall, enabling efficient removal of reaction by-products from all areas without requiring manual intervention or prolonged cleaning time
2Manufacturing precision
If cleaning gas is supplied for a long time or manual wiping is performed, then reaction by-products are removed, but the cleaning time increases
Solution Approach 1:
The multiple nozzles are pre-positioned to target specific areas where reaction by-products accumulate. The first nozzle is positioned to clean the substrate area, the second nozzle is positioned to clean the reaction tube interior, and the third nozzle is positioned to clean the manifold inner wall surface. This preliminary positioning enables immediate and effective cleaning upon gas supply, eliminating the need for prolonged cleaning time or manual intervention, thereby improving both cleaning effectiveness and efficiency
Solution Approach 2:
The patent replaces manual wiping mechanisms with an automated multi-nozzle gas supply system. The nozzles deliver cleaning gas to targeted areas, enabling efficient removal of reaction by-products through gas-phase cleaning rather than mechanical contact. This substitution improves cleaning efficiency by eliminating manual operations while maintaining or enhancing cleaning effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces the time required for cleaning by ensuring comprehensive coverage and efficient removal of reaction by-products from all areas of the process chamber, enhancing the overall efficiency of the cleaning process.
Implementation Method 1
a first cleaning process of supplying a hydrogen fluoride gas into the reaction tube through the second nozzle; and a second cleaning process of supplying a hydrogen fluoride gas onto an inner wall surface of the manifold through a third nozzle disposed in the manifold
Data Source
AI summary
A cleaning method includes (a) providing a process chamber after forming an oxide film on a substrate in the process chamber formed by a reaction tube and a manifold supporting the reaction tube by performing a cycle a predetermined number of times, the cycle including supplying a source gas to the substrate through a first nozzle in the manifold extending upward to an inside of the reaction tube, and supplying an oxidizing gas to the substrate through a second nozzle in the manifold extending upward to the inside of the reaction tube; and (b) cleaning an inside of the process chamber. The step (b) includes a first cleaning process of supplying a hydrogen fluoride gas into the reaction tube through the second nozzle; and a second cleaning process of supplying a hydrogen fluoride gas onto an inner wall surface of the manifold through a third nozzle disposed in the manifold.