Multi-Path Dielectric Cooling for Mixed-Temperature Electronics
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Solution Overview
Problem
Conventional fan-based cooling systems for electronics are inefficient and require significant power, while existing liquid submersion cooling systems need improvements in thermal management and energy reuse efficiency, particularly for high-density server systems.
Innovation Solution
A liquid cooling system that segregates electronic components by operating temperature, allowing dielectric coolant to flow in direct contact for individual cooling, with a controlled flow path that maximizes heat transfer and energy reuse by using a multi-stage circulation network.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If fan-based cooling systems are used for electronics, then cooling function is provided, but power consumption increases significantly and cooling efficiency decreases
Solution Approach 1:
The patent applies liquid cooling technology, using a dielectric liquid to directly contact and cool electronic components. This hydraulic cooling method replaces traditional fan-based air cooling, significantly reducing power consumption while improving cooling efficiency through direct heat transfer from components to the liquid coolant.
2Reliability
If electronic components are cooled by direct submersion in dielectric liquid, then cooling effectiveness improves, but thermal management efficiency and energy reuse capability need improvement
Solution Approach 1:
The patent segments electronic components into different temperature zones (high-temperature components like CPUs/GPUs and low-temperature components like memory and storage). Each zone has dedicated coolant flow paths, allowing optimized thermal management for each component type and enabling efficient heat recovery by directing heat from different zones to appropriate cooling or heat reuse applications.
Solution Approach 2:
The patent provides localized cooling solutions by directing coolant flow specifically to high-heat-generating components first, then allowing the warmed coolant to flow to lower-temperature components. This creates different thermal environments in different regions of the system, optimizing both cooling effectiveness and energy reuse by matching coolant temperature with component thermal requirements.
3Device complexity
If multiple electronic components with different operating temperatures are cooled by a single coolant flow path, then system complexity is reduced, but cooling precision and energy reuse efficiency decrease
Solution Approach 1:
The patent divides the cooling system into multiple segmented flow paths with separate inlets and outlets for different temperature zones. High-temperature components have dedicated coolant channels, while low-temperature components have separate channels. This segmentation enables precise temperature control for each component type while maintaining manageable system complexity through modular design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently cools electronic components at high temperatures, ensuring a uniform coolant temperature for effective heat transfer and energy reuse, optimizing the performance of heat exchangers and reducing power consumption.
Implementation Method 1
The heat generated by the circuit is removed quickly and efficiently by the dielectric liquid directly at the heat source
Implementation Method 2
The dielectric liquid is circulated and cooled through the use of heat exchangers and the likes
Data Source
AI summary
A liquid cooling apparatus and system for the immersion cooling of electronic devices including in particular servers and other IT hardware nodes having an array of heat generating devices including microprocessors, RAM, motherboards etc having different operational temperatures. The present apparatus and system is adapted for at least an in-series flow of cooling liquid in direct contact with the different heat generating devices so as to provide multi-stage heat transfer phases for enhanced energy efficiency and operational control and performance of the electronic device.