Multi-Position Contact End Effector for Wafer Handling

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Solution Overview

Problem

In semiconductor wafer processing, existing methods require separate apparatuses for handling pre-cleaning and post-cleaning wafers due to contamination concerns, leading to inefficiencies in handling and transportation.

Innovation Solution

An apparatus with two segregated sets of contact points that can be translated between positions to engage or disengage with the substrate, allowing for the transportation of pre-cleaning and post-cleaning wafers using the same device without cross-contamination, by segregating the contact points to maintain cleanliness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate apparatuses are used for handling pre-cleaning and post-cleaning wafers, then contamination is avoided, but device complexity and handling efficiency deteriorate

Engineering Contradiction:

Improvecontamination avoidanceVSAvoidapparatus separation

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges two separate apparatuses into a single end effector by integrating two sets of contact points (first and second contact points) on the same substrate holder. This allows both pre-cleaning and post-cleaning wafer handling to be performed by one unified device, reducing system complexity while maintaining contamination avoidance through spatial separation of contact points during different operational modes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The end effector is segmented into two distinct sets of contact points (first contact points and second contact points) that are spatially separated on the substrate holder. This segmentation allows each set to be independently positioned and used for specific cleaning stages, preventing cross-contamination while utilizing a single apparatus.

Inventive Principle:

Principle #1Segmentation

2Reliability

If separate apparatuses are used for pre-cleaning and post-cleaning wafer handling, then contamination is avoided, but productivity deteriorates

Engineering Contradiction:

Improvecontamination avoidanceVSAvoidhandling efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

By combining both pre-cleaning and post-cleaning handling capabilities into a single end effector with two sets of contact points, the system eliminates the need to switch between separate apparatuses during wafer processing. This merging improves productivity by streamlining the workflow while maintaining contamination avoidance through the spatial separation and selective positioning of contact points.

Inventive Principle:

Principle #5Merging (Combining)

3Device complexity

If multiple sets of contact points are integrated on a single apparatus, then device complexity is reduced, but contamination risk increases

Engineering Contradiction:

Improveapparatus integrationVSAvoidcontamination risk

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The contact points are segmented into two distinct sets (first and second contact points) positioned at different locations on the substrate holder. This spatial segmentation prevents cross-contamination by ensuring that only the appropriate set of contact points is positioned to engage with the substrate at any given time, eliminating the contamination risk associated with integrated multi-functional contact points.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate holder is designed to be rotatable, allowing dynamic repositioning between different contact point sets. This dynamic capability enables the system to switch between pre-cleaning and post-cleaning modes by rotating the holder to bring the appropriate contact points into engagement position, thereby preventing contamination while utilizing an integrated apparatus.

Inventive Principle:

Principle #15Dynamics

4Manufacturing precision

If contact points are fixed on the substrate holder, then manufacturing precision is improved, but adaptability deteriorates

Engineering Contradiction:

Improvecontact point positioningVSAvoidcleaning stage flexibility

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The substrate holder incorporates rotational capability that allows dynamic repositioning between fixed contact point sets. This dynamic feature provides adaptability for different cleaning stages (pre-cleaning and post-cleaning) while maintaining the manufacturing precision of the fixed contact point positions on the holder. The system achieves versatility through motion rather than through movable or adjustable contact points.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS9214375B2End effector having multiple-position contact points

Publication Date: 2015.12.15 LAM RES CORP

AI summary

An apparatus is provided for lifting a substrate. The apparatus comprises a first piece and a second piece. The apparatus further comprises a set of first contact points in a plane and a set of second contact points, where at least one contact point from each set is present on the first piece and the second piece. The apparatus also comprises an actuator that translates the first piece, substantially parallel to the plane, between a first position and a second position relative to the second piece. Additionally, the first position arranges the set of first contact points so that all of the contact points of the set of first contact points are able to engage the substrate, and the second position arranges the set of second contact points so that all of the contact points of the second set of contact points are able to engage the substrate.