Multi-Primary Transformer Voltage Boosting for Power Amplifier Integration

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Solution Overview

Problem

Fully integrating a high-power amplifier on a single chip is challenging due to bulky power matching structures that occupy large chip areas, degrading performance of other mobile application functions, necessitating improved power matching designs to isolate and miniaturize the matching structure while maintaining high output power.

Innovation Solution

A power amplifier system with multiple primary windings having fewer turns and a single secondary winding with more turns, inductively coupled to boost voltage and provide impedance matching between the power amplifiers and loads, allowing for compact and efficient power amplification.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a power amplifier is fully integrated on a single chip, then integration is improved, but the bulky power matching structures require large chip area

Engineering Contradiction:

ImproveintegrationVSAvoidchip area

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The transformer is divided into multiple primary windings and a secondary winding with distinct functional sections. Each primary winding can be independently connected to different power amplifier outputs, allowing the matching structure to be segmented across the chip while maintaining compact overall dimensions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs planar transformer designs that utilize multiple metal layers and via connections to create three-dimensional winding structures on a two-dimensional chip surface. This dimensional transition allows complex matching networks to be implemented in a compact footprint by utilizing the vertical dimension through multi-layer construction.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If the matching structure is distributed on the whole chip area, then power matching is improved, but the high output power degrades the performance of other mobile application functions

Engineering Contradiction:

Improvepower matchingVSAvoidperformance degradation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

Multiple primary windings are magnetically coupled to a single secondary winding, merging the power paths from multiple amplifiers into one consolidated output. This combination reduces the distributed matching structures that cause performance degradation while maintaining effective power matching through the unified transformer coupling.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The transformer acts as an intermediary device that isolates the high-power amplifier outputs from other mobile application functions on the chip. By providing magnetic coupling and impedance transformation, the transformer mediates between the power amplifiers and the load, preventing harmful electromagnetic interference while maintaining power matching.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If the matching structure is isolated into one area, then isolation from other functions is improved, but the total matching structure size should be reasonably small to be cost effective

Engineering Contradiction:

ImproveisolationVSAvoidmatching structure size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The transformer windings are arranged in a nested configuration where multiple primary windings are positioned around or adjacent to a central secondary winding. This nested layout allows the matching structure to be compactly contained within a small isolated area while providing sufficient space for proper magnetic coupling and electrical connections.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent utilizes thin-film deposition techniques to create planar spiral windings and interdigitated capacitor structures that form the matching network. These thin-film implementations allow the matching structure to be isolated in a compact area with minimal height, reducing the overall footprint while maintaining electrical performance.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables a compact, cost-effective, and high-power amplifier system by boosting voltage and achieving impedance matching, thereby improving the integration of power amplifiers without degrading other mobile application functions.

Implementation Method 1

a single secondary winding inductively coupled to the plurality of primary windings

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS7675365B2Systems and methods for power amplifiers with voltage boosting multi-primary transformers

Publication Date: 2010.03.09 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

Systems and methods may be provided for a power amplifier system. The systems and methods may include a plurality of power amplifiers, where each power amplifier includes at least one output port. The systems and methods may also include a plurality of primary windings each having a first number of turns, where each primary winding is connected to at least one output port of the plurality of power amplifiers, and a single secondary winding inductively coupled to the plurality of primary windings, where the secondary winding includes a second number of turns greater than the first number of turns.