Multi-spot Scanning Collection Optics for Semiconductor Wafer Inspection

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Solution Overview

Problem

Current inspection and metrology systems for semiconductor wafers face challenges in accurately detecting defects and measuring characteristics due to issues with spot crosstalk and system complexity, particularly when using acousto-optic deflector (AOD) systems that generate multiple scanning spots with varying magnifications.

Innovation Solution

The system employs a longitudinal imaging approach with multiple detection channels, including normal and oblique illumination sub-channels, and a combination of optics elements like serrated teeth apertures and diffraction gratings to isolate and separate scanning spots, minimizing crosstalk and maintaining fixed collection magnification for efficient defect detection and characterization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple scanning spots are generated using AOD systems, then inspection throughput is improved, but spot crosstalk increases

Engineering Contradiction:
Improveinspection throughputVSAvoidspot crosstalk
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent segments the inspection system into multiple independent detection channels (first longitudinal side channel, second longitudinal side channel, and normal channel), each responsible for collecting light from specific scanning spots. This segmentation isolates the detection paths to prevent crosstalk while maintaining high throughput through parallel processing of multiple spots

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces longitudinal side channels that collect light from the side (longitudinal dimension) in addition to the normal channel that collects from the top (vertical dimension). This multi-dimensional collection approach allows simultaneous detection of multiple scanning spots without interference, resolving the crosstalk issue while maintaining high inspection throughput

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If multiple detection channels are added to reduce crosstalk, then measurement accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvedefect detection accuracyVSAvoidsystem complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent designs the multiple detection channels (first longitudinal side channel, second longitudinal side channel, and normal channel) to share common optical components and processing pathways where possible. Each channel serves a specific function for different scanning spots, but they utilize shared resources to minimize overall system complexity while maintaining high measurement precision through specialized detection paths

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If fixed collection magnification is used, then system complexity is reduced, but adaptability to different spot magnifications is worsened

Engineering Contradiction:
Improvecollection magnification systemVSAvoidspot magnification matching
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent transitions from a single magnification system to a multi-dimensional detection approach with longitudinal side channels and normal channel operating in parallel. This allows the system to maintain fixed collection magnification for each channel while adapting to different spot magnifications through the geometric arrangement and optical path design of multiple channels, resolving the contradiction between simplicity and adaptability

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the accuracy and efficiency of defect detection and measurement by minimizing spot crosstalk and system complexity, allowing for high-throughput inspection with improved sensitivity and reduced noise, while maintaining cost-effectiveness.

Implementation Method 1

an illumination channel for generating and scanning a plurality of incident beams to form a plurality of spots that scan across a segmented line comprised of a plurality of scan portions of the specimen

Methodology Applied
Scientific EffectAcousto-optic effect: Acousto-optic Effect

Implementation Method 2

measuring the amount of light scattered by the illuminated spot on the wafer

Methodology Applied
Scientific EffectLight scattering: Scattering

Implementation Method 3

a combination of optics elements like serrated teeth apertures and diffraction gratings to isolate and separate scanning spots

Methodology Applied
Scientific EffectDiffraction: Diffraction

Data Source

PatentUS9970883B2Multi-spot scanning collection optics
Publication Date: 2018.05.15 KLA CORP
  • US9970883B2 patent drawing
  • US9970883B2 patent drawing
  • US9970883B2 patent drawing

AI summary

Disclosed are apparatus and methods for inspecting or measuring a specimen. A system comprises an illumination channel for generating and deflecting a plurality of incident beams to form a plurality of spots that scan across a segmented line comprised of a plurality of scan portions of the specimen. The system also includes one or more detection channels for sensing light emanating from a specimen in response to the incident beams directed towards such specimen and collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion. The one or more detection channels include at least one longitudinal side channel for longitudinally collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion.