Optically Investigating Flaws/Contamination TRIZ Cases

A generation unit combines partial region image data from multiple light emitting units to support precise surface shape measurement.

Adaptive illumination shapes light to capture bright field, dark field, or combined images, resolving manual inspection subjectivity and vision fatigue.

A camera device captures strip-shaped images from oblique angles to inspect plate surfaces.

A defect inspecting apparatus corrects imaging height using temperature and pressure data to maintain optical focus.

Automated optical measurement replaces subjective visual inspection, ensuring objective quality control for mobile devices.

Asymmetric magnification matches illumination area to detector axis, resolving detector density versus exposure time trade-off.

Statistical analysis of diffraction asymmetry predicts grating imbalance sensitivity, correcting overlay errors caused by structural stack differences.

A display panel integrates a crack sensing portion with a cover layer to detect structural defects near an opening region.

A concave mirror system projects a planar light pattern onto the camera entrance pupil to ensure uniform illumination across the image field.

Fourier transform infrared spectrometer detects etching residues via characteristic absorption peaks.

Traveling lens acousto-optic devices manipulate optical beams for semiconductor wafer inspection.

A multi-wavelength optical detection system illuminates objects with distinct light beams to capture images for defect analysis.

An optical measurement system calculates plastic bottle wall mass distribution via infrared light transmission, avoiding destructive sampling delays.

A two-dimensional inspection module identifies non-reflecting regions on thinned dies as potential defects.

A differential interference contrast surface inspection apparatus uses polarization equalization to generate balanced interference signals for precise height measurement.

Branching light into two optical paths allows simultaneous illumination of different sample areas, reducing inspection time and complexity.

A backlit imaging apparatus captures low distortion images of plugged honeycomb bodies to identify internal defects.

A dynamic spatial filter adjusts light shading patterns to detect wafer defects with high accuracy.

VUV optical metrology instruments integrate photodesorption cleaning to remove surface contaminants without adding external hardware.

A detection circuit adjusts amplifier response characteristics based on radius position information to optimize signal processing.

Diffraction grating replaces unstable polystyrene latex particles to eliminate size dispersion and environmental instability during calibration.

Multi-camera array captures images at different heights to measure blind hole depth, eliminating sequential scanning delays.

A lithographic mask inspection system assigns distinct process parameters to areas containing printable features for targeted defect detection.

Longitudinal side channels and serrated apertures isolate scanning spots to reduce crosstalk while maintaining fixed collection magnification.

Optical detection maps contaminant locations on encapsulation moulds to enable targeted cleaning, preventing new surface damage during the process.

Angularly-spaced collimated radiation beams pass through shiny parts to create unobstructed light paths, reducing inter-reflection that obscures laser lines.

Synchronous spatial light modulation reduces dynamic range in wafer inspection images, eliminating ghosting and flaring artifacts while maintaining throughput.

Adjusting inspecting module height using warpage tendency from prior regions reduces inspection time while maintaining measurement precision.

A diffusing screen images reflected light beams from container walls onto a sensor, resolving optical aberrations caused by non-parallel surfaces.

Waveguide mode segmentation resolves intensity versus uniformity contradictions by distributing beam energy across multiple transverse modes.

Optical sub-system directs illumination through an objective to collect scattering and phase signals from a sample surface.

Pneumatic injection deposits a controlled silicone-air mixture inside glass bottles for precise internal coating.

A photoluminescent material selectively binds to substrate features to enhance defect signals via area-dependent emission.

Geometric alignment of periodic light patterns constructs phase images to distinguish refractive defects from non-uniform glass distribution.

Sequential multi-directional illumination reduces surface color influence on reflected light intensity, enabling accurate tilt determination.

A TDI-CCD scanning differential interference contrast system merges polarized light paths to enhance spatial resolution and defect detection sensitivity.

Adding fluorescent taggants to machinery lubricants enables rapid oil contamination detection through ultraviolet irradiation.

A luminescent agent binds to residual soil within endoscope lumens and emits visible light under ultraviolet excitation for precise optical detection.

Vacuum EUV actinic mask review system adjusts components and acquires images without venting, eliminating photoresist development time.

Real-time laser profilometry detects edge wall non-conformances during cutting, reducing rework time by enabling immediate calibration adjustments.

Tilted focal planes project parallel lines at different heights to enable fast 3D measurements without mechanical scanning.

Artificial surface features withstand laser damage to enable accurate detection of particle sizes below 18 nm.

Sequential dual-angle illumination with image subtraction isolates surface defects from specular reflections on high-speed glossy sheets.

Multiple imaging elements capture substrate profiles within a load lock chamber, enabling detection of small defects that laser sensors miss.

Periodic light patterns and phase image analysis distinguish refractive defects from material distribution irregularities in high-speed container inspection.

A guided inspection system classifies semiconductor wafer defects by analyzing optical images against design data patterns.

Periodic multi-angle LED illumination resolves reflection artifacts on glossy surfaces to determine accurate surface topography.

A micro-scale optical capture system uses an extension tube and high-power LEDs to achieve 1:1 magnification.