2D and 3D Inspection for Pit Defects in Thinned Dies
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Solution Overview
Problem
InFO packages face challenges in detecting and measuring pit defects in the molding compound, which are critical for ensuring the integrity and reliability of thinned dies, especially given the complexity of advanced process nodes and the potential for costly design mistakes.
Innovation Solution
A method and system utilizing a two-dimensional inspection module to identify non-reflecting regions as potential defects and a depth measurement module to measure their depth, defining defects when the depth exceeds a threshold, specifically targeting pit defects in excess of 8 microns, thereby ensuring accurate detection and prevention of deformation in sacrificial and redistribution layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a two-dimensional inspection module is used to detect pit defects, then the detection speed is improved, but the measurement precision of defect depth is insufficient
Solution Approach 1:
The patent combines a two-dimensional inspection module and a three-dimensional inspection module into a single integrated inspection system. The 2D module performs rapid initial scanning to identify suspected defects, while the 3D module provides precise depth measurement for confirmed defects, thus achieving both high detection speed and accurate depth measurement.
Solution Approach 2:
The inspection process is divided into two stages: first, the 2D inspection module quickly identifies potential defect regions; second, the 3D inspection module performs detailed depth measurement only on suspected defects. This segmentation allows the system to maintain high overall detection speed while achieving precise measurements where needed.
2Reliability
If advanced process nodes are used for chip manufacturing, then the performance is improved, but the difficulty of detecting and measuring defects increases
Solution Approach 1:
The system performs preliminary 2D inspection to identify and flag suspected defect regions before conducting detailed 3D measurements. This preliminary action filters out false positives and reduces the complexity of subsequent measurements by focusing only on regions that require detailed analysis.
Solution Approach 2:
The patent transitions from two-dimensional defect detection to three-dimensional measurement by incorporating depth information. This dimensional enhancement allows the system to accurately characterize pit defects in advanced nodes by measuring not just the presence but also the depth and three-dimensional morphology of defects.
3Area of stationary object
If multiple dies are packaged together in InFO package, then the footprint is reduced, but the complexity of ensuring system-level integrity increases
Solution Approach 1:
The inspection system is designed to handle multiple dies within a single InFO package using the same 2D and 3D inspection modules. The system can identify and measure defects across different dies and layers, providing universal inspection capability that simplifies the verification of system-level integrity despite the increased complexity of multi-die packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a fast and reliable detection process for pit defects, enhancing the integrity and reliability of InFO packages by accurately identifying and measuring defects, thus reducing the risk of costly failures and optimizing package performance.
Implementation Method 1
inspecting the thinned die with a two-dimensional inspection module, to find suspected defects that appear as non-reflecting regions
Implementation Method 2
measuring, using a depth measurement module, a depth of the suspected defects
Data Source
AI summary
A method for detecting defects in a thinned die, the method may include inspecting the thinned die with a two-dimensional inspection module, to find suspected defects that appear as non-reflecting regions that fulfill a size condition; measuring, using a depth measurement module, a depth of the suspected defects; and defining a suspected defects as a defects when the depth parameter exceeds a depth threshold.