Multi-Wavelength Optical Detection for Electronic Device Defects
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Solution Overview
Problem
Existing detection systems for electronic devices struggle to effectively detect defects in materials, especially when these materials are located at the bottom of a structure or have high reflectivity or low transmittance, limiting the use of visible light-based inspection methods.
Innovation Solution
A detection system comprising an optical detection module with multiple light sources of different wavelengths (between 300 nanometers and 3000 nanometers) and an image capturing component, coupled with a control module to analyze images and determine defects, enabling real-time non-destructive testing during electronic device manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If visible light is used for detection, then the detection system is simple and easy to operate, but it cannot effectively detect defects in materials with high reflectivity or low transmittance
Solution Approach 1:
The patent changes the wavelength parameter of the light source from visible light to infrared light (specifically 300-3000nm range). This parameter change allows the detection system to penetrate materials with high reflectivity or low transmittance that block visible light, thereby improving both defect detection capability and material detection range without increasing system complexity
Solution Approach 2:
The patent substitutes visible light-based optical detection with infrared light-based optical detection. This substitution enables the system to detect defects in materials that are invisible to visible light, such as polymer materials and materials at the bottom of structures, while maintaining the non-contact and automated nature of the detection system
2Measurement precision
If multiple light sources of different wavelengths are used, then the defect detection rate improves, but the device complexity increases
Solution Approach 1:
The patent designs the optical detection module to handle multiple wavelengths (300-3000nm range) through a unified detection path. The image capturing component and control module can process infrared light across this broad spectrum, allowing a single system to detect various material types and defect conditions without requiring separate detection systems for each wavelength range
Solution Approach 2:
The patent combines multiple light sources of different wavelengths into a single optical detection module with a shared detection path. By merging the infrared light sources and detection components into one integrated module, the system achieves multi-wavelength detection capability while minimizing the increase in device complexity compared to using separate detection systems
3Productivity
If real-time detection is implemented during manufacturing, then production capacity increases, but the requirement for advanced detection technology increases
Solution Approach 1:
The patent replaces complex visible light detection methods with infrared light detection that naturally penetrates polymer materials and materials at the bottom of structures. This substitution simplifies the detection technology requirements for real-time manufacturing inspection while enabling comprehensive defect detection across all material layers, thereby supporting increased production capacity
Solution Approach 2:
The patent uses infrared light wavelength (300-3000nm) as the detection parameter, which provides inherent penetration capability through various materials. This parameter choice reduces the complexity of detection technology needed for real-time manufacturing, as the infrared light automatically overcomes the limitations of visible light without requiring additional complex processing or multiple detection systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system improves the rate of defect detection, enhances the ability to penetrate polymer materials, and increases the yield and production capacity of electronic devices by performing real-time quality management during manufacturing.
Implementation Method 1
The first light source provides a first light beam to illuminate an object to be measured. The second light source provides a second light beam to illuminate the object to be measured.
Implementation Method 2
The image capturing component is coupled to the first light source and the second light source and is used to capture an image of the object to be measured.
Data Source
AI summary
A detection system is provided. The detection system includes an optical detection module and a control module. The optical detection module includes a first light source, a second light source, and an image capturing component. The first light source provides a first light beam to illuminate an object to be measured. The second light source provides a second light beam to illuminate the object to be measured. The image capturing component is used to capture the object to be measured. The wavelength of the first light beam is different from the wavelength of the second light beam. The wavelength of either the first light beam or the second light beam is between 300 nanometers and 3000 nanometers. The control module receives and analyzes an image of the object to be measured obtained from the image capturing component to determine whether the object to be measured has a defect.