Multi-Stage Ejector Sequencing for Chip Separation From Dicing Tape
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Solution Overview
Problem
Conventional ejectors for separating semiconductor chips from dicing tape require multiple vertical driving units, leading to high costs and complex motion control, necessitating a simpler and cost-effective solution.
Innovation Solution
A multi-stage ejector with a lifting unit that moves all ejecting blocks upward simultaneously and then sequentially downward, or in alternating stages, to separate the dicing tape from the semiconductor chip, utilizing a reduced number of vertical driving units and precise control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple vertical driving units are used for each ejecting block, then the separation function is improved, but the device complexity and cost increase
Solution Approach 1:
Multiple ejecting blocks are merged into a single integrated structure that moves together as one unit. The lifting unit applies a single upward force that simultaneously elevates all ejecting blocks, eliminating the need for individual vertical driving units for each block while maintaining the separation function.
Solution Approach 2:
The separation process is segmented into two distinct phases: (1) simultaneous upward movement of all ejecting blocks to lift the dicing tape, and (2) sequential downward movement from outer to inner blocks to achieve progressive separation. This segmentation allows a single driving unit to replace multiple driving units.
2Manufacturing precision
If multiple vertical driving units are used for each ejecting block, then the separation control is improved, but the control complexity increases
Solution Approach 1:
All ejecting blocks are preliminarily positioned and connected to the lifting unit before the separation process begins. The lifting unit pre-coordinates the upward movement of all blocks simultaneously, eliminating the need for complex real-time control of multiple independent driving units during the separation process.
Solution Approach 2:
The separation process uses periodic action with two distinct phases: first, all ejecting blocks move upward simultaneously in one periodic action; second, the blocks move downward sequentially from outer to inner in another periodic action. This periodic control simplifies the control algorithm compared to continuous control of multiple driving units.
3Productivity
If all ejecting blocks move upward simultaneously and then downward sequentially, then the separation efficiency is improved, but the motion control complexity increases
Solution Approach 1:
The system transitions from a static configuration to a dynamic one where ejecting blocks change their vertical positions in a controlled sequence. The lifting unit dynamically adjusts the height of each ejecting block during the separation process, enabling efficient separation while using a single driving unit with simplified control logic.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates reliable and cost-effective separation of semiconductor chips from dicing tape with simplified control algorithms, reducing the need for multiple vertical driving units and enhancing separation efficiency.
Implementation Method 1
a lifting unit that moves all the ejecting blocks upward by operation of a driving module
Implementation Method 2
holding the dicing tape T by suction
Data Source
AI summary
Disclosed is a multi-stage ejector for separating a pickup-target chip from dicing tape in stages. The multi-stage ejector includes a plurality of ejecting blocks each including a contact portion that comes into contact with dicing tap, a lifting unit including a driving module configured to move the ejecting blocks upward or downward, and a restriction unit configured to limit a lifting height of each of the ejecting blocks. All of the ejecting blocks move upward so that the contact portions come into contact with the dicing tape, and then the ejecting blocks sequentially move downward, starting from the ejecting block having the contact portion positioned at an outermost side, to the same vertical level.