Multi-Stage Plating Drilling Filling Process for High-Density Interconnects
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Solution Overview
Problem
The challenge is to achieve a thinner plating layer with improved hole filling rate and reduced line impedance and mechanical defects caused by pinholes in the etching process, which is crucial for high-density interconnection boards.
Innovation Solution
A multi-stage plating drilling filling process with adjustable current densities is implemented, where the substrate undergoes a series of plating stages with specific current densities and times to form a plating layer of fixed thickness, utilizing a power supply device and plating tank with a cathode and anode in a plating solution, allowing for precise control of plating layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plating time is extended to improve hole filling rate and flatness, then drilling filling rate increases, but total plating layer thickness increases significantly exceeding product specification
Solution Approach 1:
The plating process is divided into multiple stages with different current densities. The first stage uses high current density to rapidly fill holes and achieve flatness, while subsequent stages use lower current densities to complete plating without excessive thickness accumulation. This segmentation of the plating process allows independent optimization of hole filling and thickness control.
Solution Approach 2:
The current density is dynamically adjusted during the plating process. The power supply device changes current density based on plating stage and hole filling status, transitioning from high current density for rapid filling to lower current density for precise thickness control, thereby resolving the contradiction between filling rate and thickness control.
2Length of moving object
If etching process is used to reduce plating layer thickness to meet specification, then thickness is reduced, but pinholes are generated on surface causing high line impedance and poor mechanical properties
Solution Approach 1:
The multi-stage plating process performs preliminary hole filling and flatness adjustment in the first stage with high current density, ensuring complete hole filling before final thickness completion. This preliminary action prevents the need for subsequent etching that would create pinholes and compromise reliability.
Solution Approach 2:
The invention converts the potential harm of high current density (which could cause uneven plating) into a benefit by using it strategically in the first stage to rapidly fill holes and establish flatness, then transitioning to lower current densities to complete plating with precise thickness control, eliminating the need for harmful etching processes.
3Device complexity
If single-stage plating is used to control process simplicity, then process complexity is low, but current density uniformity is poor causing recessed plating at hole ends
Solution Approach 1:
The plating process is segmented into multiple stages, each with optimized current density parameters. The first stage uses high current density for hole filling, while subsequent stages use lower current densities for thickness completion. This segmentation improves current density uniformity and plating flatness while maintaining manageable process complexity through systematic parameter control.
Solution Approach 2:
The invention changes the current density parameter across different plating stages. By adjusting current density from high to low across stages, the process achieves uniform current distribution and flat plating surfaces, resolving the contradiction between process simplicity and plating quality through controlled parameter variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the drilling filling rate while maintaining a fixed total plating thickness, reducing the risk of pinholes and improving mechanical properties, thus addressing the issues of thick plating layers and line impedance.
Implementation Method 1
The power supply device is activated and set to perform a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density for a M-th plating time to form a M-th plating layer on the to-be-plated layer
Implementation Method 2
The power supply device is configured to supply power and adjust a current density for plating
Data Source
AI summary
A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.