Multi-step LED Heat Slug for Thermal Management
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Solution Overview
Problem
Conventional LED packages face challenges in heat dissipation efficiency, leading to reduced lifespan and increased failure rates due to heat generation from high-power light emission, and issues with mold separation and resin leakage during manufacturing.
Innovation Solution
A heat conducting slug with a multi-step structure is introduced, featuring interlocking rectangular rims and a concave portion with a reflective surface to enhance heat dissipation and prevent slug separation from the housing, while grooves in the housing manage resin leakage during molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the input current is increased to achieve high power light emission, then luminous power is improved, but heat generation increases
Solution Approach 1:
The slug is divided into multiple steps with different cross-sectional areas, creating multiple heat dissipation pathways. The multi-step structure segments the heat flow path, allowing heat to be dissipated through different areas and directions, thereby improving overall heat dissipation efficiency while maintaining high power operation.
Solution Approach 2:
The invention transitions from a conventional single-level slug structure to a multi-step three-dimensional structure. This dimensional change creates additional heat dissipation surfaces and pathways, enabling more effective heat management in the vertical dimension while supporting high power luminous output.
2Productivity
If liquid resin is injected at high pressure into the mold, then molding speed is improved, but mold separation occurs
Solution Approach 1:
The housing is designed with a protrusion that preliminarily prevents mold separation by providing a mechanical stop or guide feature. This preliminary anti-action counteracts the separating force generated during high-pressure resin injection, maintaining mold contact stability without reducing injection pressure or molding speed.
3Productivity
If liquid resin is injected at high pressure into the mold, then molding speed is improved, but resin leakage occurs
Solution Approach 1:
The housing protrusion serves as a preliminary barrier that prevents resin leakage by maintaining proper mold alignment and contact during high-pressure injection. This structural feature counteracts the leakage tendency caused by high injection pressure, allowing high molding speed to be maintained without resin loss.
4Adaptability or versatility
If the slug is mounted after the housing is formed, then assembly flexibility is improved, but slug separation occurs
Solution Approach 1:
The housing is designed with an asymmetric protrusion feature that provides mechanical engagement with the slug. This asymmetric structure creates a one-way locking mechanism that allows the slug to be mounted after housing formation while preventing separation, thereby maintaining both assembly flexibility and connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-step slug structure effectively distributes heat dissipation, reduces failure rates by maintaining slug-housing contact, and prevents resin overflow, thereby improving LED package performance and reliability.
Implementation Method 1
a heat conducting slug having a multi-step structure, wherein a slug structure of an LED package is configured into a multi-step structure so that heat generated from a light emitting chip is efficiently dissipated
Implementation Method 2
a concave portion, on which the light emitting chip is mounted, and a reflective surface formed on the concave portion
Data Source
AI summary
The present invention relates to a light-emitting diode package having a plurality of inner leads, a plurality of outer leads extending from the inner leads, a slug electrically connected to at least one of the inner leads, the slug having a thermally conductive material, a light-emitting chip arranged on the slug, and a housing supporting the light-emitting diode package.