Multi-Target Sputtering for Uniform Coating on Curved Surfaces
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Solution Overview
Problem
Conventional sputtering systems struggle to achieve uniform film thickness on curved surfaces due to unequal target distances, leading to non-uniform sputtering rates and requiring additional masks that reduce overall sputtering efficiency.
Innovation Solution
A sputtering system with independently controlled sputtering units, each equipped with a driving shaft and target, allows for precise adjustment of distance and orientation to match the curvature of the surface, using a controller to ensure uniform sputtering across non-uniform three-dimensional surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask is additionally installed to change the thickness of the sputtered film on a curved surface, then the uniformity of the sputtered film is improved, but the overall sputtering rate is greatly reduced
Solution Approach 1:
The patent divides the sputtering system into multiple independently controllable sputtering units (first sputtering unit, second sputtering unit, etc.), each targeting a specific section of the curved surface. This segmentation allows each unit to be optimized independently for its local area, achieving uniform film thickness without requiring masks that would reduce overall sputtering rate.
Solution Approach 2:
Each sputtering unit is configured with specific distance adjustments and target orientations tailored to its corresponding section of the curved surface. The first sputtering unit targets the first section with specific distance d1, while the second sputtering unit targets the second section with distance d2, allowing local optimization of film uniformity without compromising overall productivity.
2Manufacturing precision
If the distances of all targets to the surface of the object are made equal, then the sputtered film has a uniform thickness, but this cannot be achieved on curved surfaces
Solution Approach 1:
The patent employs adjustable distance mechanisms for each sputtering unit, allowing the distances d1, d2, etc. to be dynamically adjusted according to the specific curvature and geometry of different surface sections. This dynamic adjustment capability enables uniform film deposition on curved surfaces while maintaining high sputtering rates.
Solution Approach 2:
The patent transitions from a single-planar-target approach to a multi-unit three-dimensional configuration, where sputtering units are positioned at different spatial locations and distances to match the three-dimensional curvature of the surface. This dimensional expansion allows simultaneous achievement of uniformity and adaptability to complex geometries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables uniform sputtering on complex surfaces, improving film thickness consistency and maintaining high sputtering rates without the need for additional masks, thus enhancing overall sputtering efficiency.
Implementation Method 1
a sputtering system suitable for sputtering an object with a curved surface
Data Source
AI summary
A sputtering system is suitable for sputtering a surface to be sputtered having sections. Each section has a projection height. The sputtering system includes a supporting plate, a sputtering array, and a controller. The sputtering array is arranged on the supporting plate. The sputtering array includes sputtering units. Each section corresponds to at least one of the sputtering units. Each sputtering unit has a driving shaft and a target. The target faces the surface to be sputtered. The controller is electrically connected the driving shaft. The driving shaft drives the target to move relative to the surface to be sputtered. The controller controls a distance between each sputtering unit and the corresponding section of the sections in the direction of the projection height to satisfy a given condition.