Multi-Tiered IC Package Base for Signal Integrity
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Solution Overview
Problem
In integrated circuit packaging, the use of long wires to connect stacked integrated circuits to a common planar surface on the package base leads to increased electrical resistance, inductance, and the risk of short circuits due to wire crowding and electromagnetic coupling, compromising signal integrity.
Innovation Solution
A multi-tiered package base is introduced, where each integrated circuit is electrically connected to a respective tier with shorter wires, reducing wire length and congestion, and using vias to connect electrical contacts across tiers, thereby decreasing electrical resistance and inductance and minimizing the chance of short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If long wires are used to connect stacked integrated circuits to a common planar surface on the package base, then the integrated circuits can be electrically connected to the package base, but the electrical resistance and inductance increase and the risk of short circuits increases due to wire crowding and electromagnetic coupling
Solution Approach 1:
The patent transitions from a two-dimensional planar connection surface to a three-dimensional multi-tiered structure. Electrical contacts are distributed across multiple tiers at different vertical levels, allowing wires to connect to contacts on the same tier rather than spanning the entire height of the stacked ICs. This dimensional change reduces wire length and minimizes electromagnetic coupling between adjacent wires.
Solution Approach 2:
The package base is segmented into multiple tiers, each with its own set of electrical contacts. This segmentation divides the single planar connection surface into multiple smaller connection planes, reducing the number of wires that must traverse the entire package height and reducing wire crowding at any single location.
2Reliability
If long wires are used to connect stacked integrated circuits to a common planar surface, then electrical connection is achieved, but wire congestion and electromagnetic coupling increase the risk of short circuits
Solution Approach 1:
By introducing vertical tiering, the patent creates additional spatial dimensions for wire routing. Wires can be routed at different vertical levels corresponding to different tiers, reducing wire congestion and electromagnetic coupling. This multi-level routing approach separates wire paths in the vertical dimension, minimizing interference and short circuit risk.
3Reliability
If a multi-tiered package base is used with shorter wires for each tier, then wire length and congestion are reduced improving signal integrity, but the package base structure becomes more complex
Solution Approach 1:
The package base is divided into multiple tiers, each functioning as an independent connection plane. This segmentation allows each tier to handle a subset of electrical connections, reducing the complexity at each individual tier while collectively managing all connections. The modular tiered structure makes the overall system more manageable despite the increased number of components.
Data Source
AI summary
An integrated circuit package base includes a plurality of tiers. In some examples, an integrated circuit package encloses a plurality of stacked integrated circuits that are each electrically coupled to an electrical contact located on a respective tier of the package base. The tiers of the integrated circuit package can have different elevations relative to a bottom surface of the integrated circuit package.