Multi-Trench Integrated Passive Device for Voltage Droop Reduction
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Solution Overview
Problem
Current integrated passive devices in packages face challenges in achieving optimal performance due to inefficient power distribution networks, which can result in voltage droop and require multiple separate components, leading to increased space and cost.
Innovation Solution
A package design that incorporates a substrate with an integrated passive device featuring multiple trench capacitors, including a first and second trench capacitor configuration, where oxide, electrically conductive, and dielectric layers are strategically layered to enhance capacitance and power distribution, allowing for improved power distribution network performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate passive components are used to achieve optimal power distribution, then power distribution performance is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent combines multiple separate passive components (capacitors) into a single integrated passive device that is coupled to the substrate. This integration maintains the power distribution performance benefits of multiple capacitors while reducing device complexity and eliminating the need for multiple separate components.
Solution Approach 2:
The integrated passive device serves multiple functions within a single component, providing both decoupling and bypass capabilities across different frequency ranges. This multi-functionality replaces what would traditionally require multiple separate passive components, thereby improving power distribution performance without increasing device complexity.
2Reliability
If multiple separate passive components are used to achieve optimal power distribution, then power distribution performance is improved, but package space and cost increase
Solution Approach 1:
The patent integrates multiple capacitor functions into a single compact passive device that occupies less package space than multiple separate components would require. This merging approach maintains optimal power distribution performance while significantly reducing the overall package footprint and associated costs.
3Reliability
If capacitors are placed closer to integrated devices, then voltage droop is reduced, but space for other components is reduced
Solution Approach 1:
The integrated passive device combines multiple capacitor functions in a single compact unit that can be positioned close to the integrated device on the substrate. This integration provides the voltage droop reduction benefits of proximity placement while the compact size minimizes the space consumed, leaving more area available for other components.
4Area of stationary object
If a single passive device is used, then space and cost are reduced, but power distribution performance deteriorates
Solution Approach 1:
The integrated passive device is designed with multi-functionality, incorporating both decoupling and bypass capacitor capabilities within a single component. This allows the device to provide comprehensive power distribution performance (reducing voltage droop across multiple frequency ranges) while occupying less space and costing less than multiple separate components would require.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, cost-effective integrated passive device that improves power distribution network performance by reducing voltage droop by 15%-35% and allows capacitors to be closer to integrated devices, optimizing space usage.
Implementation Method 1
A first portion of the oxide layer, a first portion of the first electrically conductive layer, a first portion of the dielectric layer, and a first portion of the second electrically conductive layer that are located in the first trench of the passive device substrate are configured to operate as a first capacitor. A second portion of the oxide layer, a second portion of the first electrically conductive layer, a second portion of the dielectric layer, and a second portion of the second electrically conductive layer that are located in the second trench of the passive device substrate are configured to operate as a second capacitor.
Data Source
AI summary
A package that includes a substrate, an integrated device coupled to the substrate, and an integrated passive device comprising at least two capacitors. The integrated passive device is coupled to the substrate. The integrated passive device includes a passive device substrate comprising a first trench and a second trench, an oxide layer located over the first trench and the second trench, a first electrically conductive layer located over the oxide layer the first trench, a dielectric layer located over the first electrically conductive layer, and a second electrically conductive layer located over the dielectric layer.