3D Multi-Wing Silicon Capacitor for Higher Capacitance Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional multi-layer ceramic capacitors (MLCCs) fail to meet the increasing demands for small volume and high capacity in modern electronic systems, limiting their application in high integration, low power consumption, and miniaturization.
Innovation Solution
A 3D silicon capacitor with a multi-wing structure is developed, featuring a conductive structure clad with a dielectric layer, where the multi-wing structure increases surface area by alternately depositing conductor and insulator materials on a silicon substrate, enhancing capacitance density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional multi-layer ceramic capacitors (MLCCs) are used, then the capacitor can perform basic circuit functions, but the device size is large and capacitance density is low
Solution Approach 1:
The patent transitions from traditional planar capacitor structures to a three-dimensional multi-wing structure. The multi-wing structure extends vertically from the substrate with multiple wings arranged in different directions, utilizing the third dimension (height) to increase effective electrode surface area without proportionally increasing the footprint area on the substrate, thereby achieving higher capacitance density in a compact volume
Solution Approach 2:
The capacitor structure is divided into multiple discrete wings (first wing, second wing, third wing, fourth wing) that are separated and positioned at different locations. Each wing functions as an independent capacitor element with its own electrodes and dielectric layer. This segmentation allows the total capacitance to be distributed across multiple smaller units, increasing the overall surface area for charge storage while maintaining a compact form factor
2Manufacturing precision
If capacitor size is reduced for miniaturization, then integration is improved, but manufacturing precision and mechanical stability become more difficult to maintain
Solution Approach 1:
Multiple capacitor wings are merged into a single integrated multi-wing structure that shares common substrate and electrode connections. The first and second wings share a first electrode, while the third and fourth wings share a second electrode. This merging approach consolidates multiple capacitor elements into one unified structure, improving mechanical stability by reducing the number of separate components while maintaining high capacitance density through the multi-wing configuration
Solution Approach 2:
The multi-wing structure employs a nested arrangement where multiple wings are positioned in different spatial layers and directions around a central axis. The wings are nested within the three-dimensional space above the substrate, with each wing occupying a different angular position. This nested configuration maximizes the use of available space, allowing multiple capacitor elements to coexist in a compact volume while maintaining structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D silicon capacitor achieves higher capacitance density with a smaller device size, offering improved mechanical stability and precision, addressing the limitations of traditional capacitors.
Implementation Method 1
a dielectric layer is disposed between the conductive structure and the multi-wing structure to isolate the conductive structure
Implementation Method 2
the multi-wing structure increases surface area by alternately depositing conductor and insulator materials on a silicon substrate
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
Embodiments of the present disclosure provide a capacitor and a manufacturing method therefor, which can improve capacitance density of the capacitor. The capacitor includes: at least one multi-wing structure including N axis(axes) and M wings, where the N axis(axes) extends along a first direction, and the M wings are a convex structure formed by extending from a side wall(s) of the N axis(axes) toward a direction perpendicular to the first direction, a first wing of the M wings and the N axis(axes) are formed of a first conductive material, and a wing of the M wings other than the first wing is formed of a second conductive material, where M is an integer greater than or equal to 2, and N is a positive integer; a conductive structure cladding the multi-wing structure; a dielectric layer disposed between the multi-wing structure and the conductive structure to isolate the multi-wing structure from the conductive structure; at least one first external electrode, where each first external electrode iselectrically connected to some or all multi-wing structure(s) of the at least one multi-wing structure; and at least one second external electrode electrically connected to the conductive structure.