Multi-Zone Electrode RF Power Modulation for Plasma Uniformity
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Solution Overview
Problem
Conventional CCP plasma processing systems struggle to meet the increased uniformity requirements for etch processes beyond the 10 nm technological node due to variations in plasma densities and ion energy.
Innovation Solution
A multi-zone electrode array system with independent RF power control for each electrode assembly, utilizing a source controller to modulate RF power and enhance plasma field uniformity by selectively applying High Frequency and Low Frequency RF power through multiplexers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional CCP plasma processing systems are used, then the system structure is simple, but the plasma field uniformity deteriorates due to variations in plasma densities and ion energy
Solution Approach 1:
The plasma source is divided into multiple independently controllable electrode zones (e.g., center electrode, inner ring electrode, outer ring electrode). Each electrode can be controlled separately to optimize plasma distribution across different regions, thereby improving overall plasma field uniformity and etch process consistency.
Solution Approach 2:
Different electrodes are assigned different RF power levels and frequencies based on their specific positional requirements. For example, the center electrode may receive different power than the outer ring electrodes to compensate for radial plasma density gradients, achieving localized optimization of plasma conditions in each zone.
2Manufacturing precision
If multiple independently controlled electrodes are used, then plasma field uniformity is improved, but the device complexity increases
Solution Approach 1:
A single RF power source is designed to perform multiple functions by switching between different electrodes and frequencies. The system can operate in different modes (single electrode mode, multi-electrode mode, different frequency combinations) using the same hardware infrastructure, reducing overall system complexity while maintaining flexibility.
Solution Approach 2:
The RF power distribution system dynamically adjusts power levels and frequencies to each electrode based on real-time plasma conditions and process requirements. This dynamic control allows the system to adapt to varying process needs without requiring separate fixed systems for each configuration.
3Adaptability or versatility
If different RF frequencies are applied to different electrodes, then control over ion flux and ion energy is enhanced, but the power distribution system complexity increases
Solution Approach 1:
The system employs periodic switching between different RF frequencies and electrode configurations to achieve desired plasma conditions. By alternating between frequency modes and electrode activation patterns, the system can control ion flux and energy temporal profiles without requiring permanently complex multi-frequency power distribution infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved plasma field uniformity by controlling ion flux and ion energy, addressing the challenges of etch process uniformity in advanced semiconductor manufacturing.
Implementation Method 1
plasma is formed when a portion of the gas species is ionized by collisions with energetic electrons. The heated electrons dissociate some of the gas species in the gas mixture to create reactant species suitable for the exposed surface-etch chemistry
Implementation Method 2
supplying High Frequency (HF) Radio Frequency (RF) power to the first electrode assembly and Low Frequency (LF) RF power to the second electrode assembly
Implementation Method 3
controlling modulation of the RF power supplied to the plasma source to enhance uniformity of a plasma field generated by the plasma source
Implementation Method 4
A high frequency source controls the ion flux of the plasma source, and a low frequency source controls the ion energy
Data Source
AI summary
Embodiments of systems and methods for RF power distribution in a multi-zone electrode array are described. A system may include a plasma source configured to generate a plasma field. Also, the system may include an RF power source coupled to the plasma source and configured to supply RF power to the plasma source. The system may also include a source controller coupled to the RF power source and configured to control modulation of the RF power supplied to the plasma source to enhance uniformity of a plasma field generated by the plasma source.