Multi-Zone Heater Array Temperature Control
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Solution Overview
Problem
Semiconductor processing requires precise and uniform temperature control across multiple zones to maintain critical dimension uniformity, which is challenging due to complex heat transfer dynamics and non-equilibrium phenomena in plasma processing, leading to non-uniform processing rates and critical dimension inconsistencies.
Innovation Solution
A system with a multi-zone heating plate and diodes, where each planar heater zone is connected to unique power supply and return lines, allowing independent control and temperature measurement using a current measurement device and switching arrangements, enabling precise radial and azimuthal temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a multi-zone heating plate with independent power supply lines and diodes is used for each heater zone, then temperature control precision and uniformity are improved, but device complexity increases
Solution Approach 1:
The heating plate is divided into multiple independently controllable zones, each with its own power supply line and diode. This segmentation allows precise temperature control in each zone while managing complexity through modular design
Solution Approach 2:
Diodes are introduced as intermediary components between the power supply lines and heater zones. These diodes enable independent control of each heater zone by preventing current backflow, simplifying the control architecture while maintaining precision
2Measurement precision
If unique power supply lines and diodes are connected to each planar heater zone, then temperature measurement precision is improved, but device complexity increases
Solution Approach 1:
Each heater zone has dedicated power supply lines and diodes for independent temperature measurement, enabling precise monitoring of thermal conditions in each zone without interference from adjacent zones
Solution Approach 2:
The system uses the electrical characteristics of diodes in reverse bias mode to measure temperature in each heater zone. This feedback mechanism allows real-time temperature monitoring and adjustment to maintain precise thermal control
3Stability of the object's composition
If multiple switching arrangements are used to connect power lines independently, then temperature control uniformity is improved, but device complexity increases
Solution Approach 1:
The switching system is segmented into multiple independent switching arrangements, each controlling a specific power supply line or power return line. This allows independent control of each heater zone to achieve uniform temperature distribution
Solution Approach 2:
The switching arrangements enable dynamic control of power distribution to different heater zones. By actively switching power connections, the system can adjust temperature profiles in real-time to maintain uniformity across the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system achieves precise temperature control across semiconductor substrates, enhancing uniformity and consistency of processing results by actively managing temperature profiles and compensating for adverse factors, thereby improving critical dimension uniformity and yield.
Implementation Method 1
a diode is serially connected between each planar heater zone and the power supply line connected thereto or between each planar heater zone and the power return line connected thereto such that the diode does not allow electrical current flow in a direction from the power return line through the planar heater zone to the power supply line
Implementation Method 2
heating plate comprising a plurality of planar heater zones
Data Source
AI summary
A system for measuring temperatures of and controlling a multi-zone heating plate in a substrate support assembly used to support a semiconductor substrate in a semiconductor processing includes a current measurement device and switching arrangements. A first switching arrangement connects power return lines selectively to an electrical ground, a voltage supply or an electrically isolated terminal, independent of the other power return lines. A second switching arrangement connects power supply lines selectively to the electrical ground, a power supply, the current measurement device or an electrically isolated terminal, independent of the other power supply lines. The system can be used to maintain a desired temperature profile of the heater plate by taking current readings of reverse saturation currents of diodes serially connected to planar heating zones, calculating temperatures of the heating zones and powering each heater zone to achieve the desired temperature profile.