Multiaxial Probe Card Manipulator for Uniform Contact Pressure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current probe cards used in testing semiconductor devices face challenges in achieving uniform planarization of probes, leading to inconsistent electrical connections and potential damage to integrated circuit devices due to uneven pressure distribution, which hinders accurate and reliable testing.
Innovation Solution
A probing apparatus equipped with a multiaxial manipulator that includes a housing, device carrier, platen, alignment module, planarity-adjusting module, and angular adjusting module, allowing for precise adjustment of the probe card's position and angle to ensure uniform contact and prevent excessive pressure on semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple probes are equipped on a probe card to test multiple devices simultaneously, then productivity increases, but planarization difficulty increases leading to uneven pressure distribution
Solution Approach 1:
The patent implements a multiaxial manipulator with multiple driving stages that can dynamically adjust the position and angle of the probe card in real-time. This dynamic adjustment capability allows the system to compensate for planarity deviations of individual probes, ensuring uniform contact pressure across all probes while maintaining high productivity through automated multi-device testing
Solution Approach 2:
The system changes multiple parameters simultaneously including the vertical position (Z-axis), horizontal position (X-Y axes), and angular orientation of the probe card. By adjusting these parameters through the multiaxial manipulator, the system optimizes probe contact pressure distribution across multiple devices, resolving the planarization challenge while maintaining high testing throughput
2Measurement precision
If probe position is precisely adjusted to meet specification, then measurement precision improves, but device complexity increases
Solution Approach 1:
The manipulator is divided into multiple independent driving stages, each responsible for adjusting specific parameters (X-position, Y-position, Z-position, and angular orientation). This segmentation allows precise control of probe position through coordinated operation of individual stages, achieving high measurement precision while managing device complexity through modular design
Solution Approach 2:
The multiaxial manipulator serves multiple functions: positioning the probe card, adjusting probe angles, and maintaining contact pressure. By integrating these functions into a single coordinated system rather than separate mechanisms, the patent achieves high positioning precision without proportionally increasing overall device complexity
3Reliability
If probes apply pressure to contact lead pads, then electrical connection is established, but physical damage may occur to the device
Solution Approach 1:
The system dynamically adjusts the vertical position (Z-axis) and angular orientation parameters of the probe card to optimize contact pressure. By precisely controlling these parameters through the multiaxial manipulator, the system establishes reliable electrical connections while maintaining pressure within safe limits to prevent physical damage to lead pads
Solution Approach 2:
The system uses feedback from height measurements (obtained through camera or other sensing mechanisms) to adjust probe card position and angle, thereby controlling contact pressure. This feedback mechanism ensures that sufficient pressure is applied for reliable electrical connection while preventing excessive pressure that could cause physical damage to the semiconductor devices
Data Source
AI summary
A probing apparatus for testing semiconductor devices comprises a housing configured to define a testing chamber, a device carrier positioned in the housing and configured to receive the semiconductor device, a platen positioned on the housing, an alignment module positioned on the platen, a planarity-adjusting module positioned on the alignment module, an angular adjusting module positioned on the planarity-adjusting module, and a card holder positioned on the angular adjusting module and configured to receive a probe card having a plurality of probes.