Multichip Module Die Supports for Thin-Die Warpage Control

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Solution Overview

Problem

Semiconductor packages face challenges in managing warpage of thinned semiconductor dies, which can prevent successful processing and integration due to bending or warping under various forces, affecting operations like die bonding, encapsulating, and package formation.

Innovation Solution

Implementing permanent and temporary die support structures, such as mold compounds and removable materials, to reduce warpage of semiconductor dies to less than 200 microns by coupling them with planar surfaces and thickness, using materials with specific hardness, stiffness, and application methods like coating, sputtering, or etching to stabilize the dies during packaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If thinned semiconductor die are used to increase density and reduce size, then productivity and integration are improved, but warpage increases making processing and packaging difficult

Engineering Contradiction:

Improveintegration densityVSAvoidwarpage control

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

A support structure is applied to the thinned semiconductor die before packaging operations to prevent warpage from developing during subsequent processing steps. This preliminary support ensures the die remains flat and stable during die bonding, encapsulating, and wire bonding operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

An intermediary support structure is introduced between the thinned semiconductor die and the packaging environment. This support structure acts as a mediator that compensates for the inherent instability of thinned die, providing the necessary mechanical support without interfering with the final packaged product.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If support structures are applied to reduce warpage, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:

Improvewarpage controlVSAvoidstructure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The support structure is designed as a temporary element that is discarded after serving its purpose during packaging operations. Once the die are securely bonded and packaged, the support structure is removed, leaving no permanent complexity in the final product.

Inventive Principle:

Principle #34Discarding and recovering

Solution Approach 2:

The support structure uses inexpensive, easily removable materials that serve their function temporarily during manufacturing. These disposable support elements provide necessary warpage control during critical packaging steps but are discarded afterward, avoiding permanent complexity.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS12622312B2Multichip module supports and related methods

Publication Date: 2026.05.05 SEMICON COMPONENTS IND LLC

AI summary

Implementations of a semiconductor device may include a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and one of a permanent die support structure, a temporary die support structure, or any combination thereof coupled to one of the first largest planar surface, the second largest planar surface, the thickness, or any combination thereof. The first largest planar surface, the second largest planar surface, and the thickness may be formed by at least two semiconductor die. The warpage of one of the first largest planar surface or the second largest planar surface may be less than 200 microns.