Multi-Chip I/O Switching for Low-Noise Data Transfer
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Solution Overview
Problem
In multi-chip semiconductor packages, data transmission between chips can cause noise and increase current, limiting data transfer rates and power consumption.
Innovation Solution
A semiconductor device with a controller that generates enable signals for transceivers and switches to selectively couple chip I/O pads, reducing unnecessary data transmission and operation current by enabling only necessary data paths based on command and chip ID signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chip I/O pads are continuously coupled to transceivers for data transmission, then data transfer capability is maintained, but operation current increases due to unnecessary data transmission
Solution Approach 1:
The patent implements dynamic control of the data transmission system by using enable signals (TxEN, RxEN) that are generated based on command signals and chip ID signals. These enable signals dynamically activate or deactivate transceivers and switch configurations according to actual data transmission needs, allowing the system to adapt its operational state rather than maintaining a fixed continuous connection.
Solution Approach 2:
The system employs periodic enable signals that are generated in response to command signals and chip ID signals, activating transceivers only during necessary transmission intervals. This periodic activation pattern allows the system to maintain data transfer capability when needed while minimizing operation current during non-transmission periods.
2Adaptability or versatility
If all chip I/O pads are connected through lines for potential data transmission, then communication flexibility is improved, but noise increases during data transmission
Solution Approach 1:
The patent extracts or isolates active data transmission paths from the complete network of connected chip I/O pads by using switch enable signals. Only the necessary transmission paths are activated based on command and chip ID signals, while other paths remain inactive. This separation removes potential noise sources from inactive connections while preserving communication flexibility for required data channels.
3Speed
If data transmission paths are always active, then data transfer rate is maintained, but current flows into other semiconductor chips increasing power consumption
Solution Approach 1:
The system dynamically controls data transmission paths using switch enable signals that are generated in response to command signals and chip ID signals. This dynamic control ensures that data transfer paths are active only when needed for specific chip communications, preventing current from flowing into unnecessary semiconductor chips while maintaining data transfer rate for active channels.
Data Source
AI summary
A semiconductor device includes a plurality of chips, at least one line, and a controller. Each of the chips includes a chip input/output (I/O) pad, a transceiver configured to perform a transmission operation in response to a transmission enable signal or perform a reception operation in response to a reception enable signal, and a switch configured to couple the chip input/output (I/O) pad to the transceiver in response to a switch enable signal. The at least one line is configured to couple the chip input/output (I/O) pads contained in the plurality of chips. The controller generates the transmission enable signal, the reception enable signal, and the switch enable signal in response to a command signal and a chip identifier (ID) signal.