Multi-Chip Package Logic Power Supply via Driver Chip Integration

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing multi-chip package semiconductor devices face challenges in miniaturization and power supply efficiency due to the need for separate power supply circuits for each chip, especially when reducing power consumption requires adjusting voltage levels, leading to increased equipment size and cost.

Innovation Solution

Integrating a driver chip with analog circuits, including bipolar devices, to create a band gap constant voltage circuit that provides stable power supply and sufficient current to a logic chip, eliminating the need for a dedicated power supply circuit and allowing for shorter inter-chip wiring and reduced package size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate power supply circuits are used for each chip, then each chip can have its required power supply voltage, but the equipment size increases and miniaturization is prevented

Engineering Contradiction:
Improvepower supply voltage adaptabilityVSAvoidequipment size
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent merges the power supply circuit functionality into the driver chip that already contains analog circuits. The driver chip is equipped with both analog circuits and a power supply circuit that can generate multiple power supply voltages, eliminating the need for separate power supply circuits for each chip and enabling miniaturization of the equipment.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The driver chip is designed with multi-functionality, serving both as an analog circuit chip and as a power supply circuit. The power supply circuit within the driver chip can generate various power supply voltages to accommodate different chips, making the driver chip a universal component that eliminates the need for multiple dedicated power supply circuits.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Use of energy by moving object

If power supply voltage is lowered to reduce power consumption, then power consumption decreases, but a DC/DC converter is required which increases device complexity

Engineering Contradiction:
Improvepower consumptionVSAvoidpower supply circuit complexity
Core Design Contradiction:
Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The patent combines the DC/DC converter functionality with the existing power supply circuit in the driver chip. By integrating the DC/DC converter into the driver chip's power supply circuit, the patent avoids adding external power supply circuits while enabling lower operating voltages for reduced power consumption.

Inventive Principle:
Principle #5Merging (Combining)

3Productivity

If digital circuits are integrated on a logic chip, then integration is achieved, but sufficient current driving capability cannot be provided without a separate power supply circuit

Engineering Contradiction:
Improveintegration efficiencyVSAvoidpower supply circuit requirement
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges the power supply circuit with the driver chip containing analog circuits. This integration provides sufficient current driving capability for the logic chip with digital circuits without requiring a separate dedicated power supply circuit, thus maintaining high integration efficiency while avoiding increased device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient power supply to digital circuits within the same package, facilitating miniaturization and cost reduction while maintaining stable voltage performance, suitable for applications like image stabilization in cameras.

Implementation Method 1

the logic chip power supply circuit of the driver chip is a power supply circuit utilizing a band gap constant voltage

Methodology Applied
Scientific EffectBand gap voltage:

Data Source

PatentUS20090128229A1Multi-chip package semiconductor device
Publication Date: 2009.05.21 SEMICON COMPONENTS IND LLC
  • US20090128229A1 patent drawing
  • US20090128229A1 patent drawing
  • US20090128229A1 patent drawing

AI summary

An efficient logic chip operating power supply having digital circuits in a multi-chip package is provided. A multi-chip package semiconductor device fabricated in common with a driver chip having analog circuits and a logic chip having digital circuits, a logic chip power supply circuit is provided in which a driver chip creates a logic chip power supply dedicated for the logic chip. The logic chip has internal logic circuitry operating by receiving a power supply from the logic chip power supply circuit via power input terminals.