Multi-Chip Switching Layout for Oscillation-Free Voltage Sharing
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Solution Overview
Problem
Semiconductor devices, particularly those using wide bandgap semiconductors, experience oscillation phenomena due to variations in wiring resistance and inductance, leading to malfunctions and reduced reliability.
Innovation Solution
The semiconductor device incorporates resistor chips and inter-board wiring to equalize the potential differences and reduce inductance variations among semiconductor chips, stabilizing the output voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor chips are connected via conventional wiring methods, then the device can be manufactured with standard processes, but wiring resistance and inductance variations cause oscillation phenomena and reduce reliability
Solution Approach 1:
The patent connects output electrodes of semiconductor chips on different insulated circuit boards directly via inter-board wiring members, equalizing the potential among output electrodes. This equipotential connection eliminates potential differences that cause oscillation phenomena, thereby improving device reliability without requiring complex additional components
Solution Approach 2:
The patent merges the output electrode connections across multiple insulated circuit boards by directly bonding output electrodes from different boards together. This consolidation of connection points reduces the number of intermediate connection points and minimizes inductance variations, preventing oscillation while maintaining manufacturing feasibility
2Power
If multiple insulated circuit boards are used to accommodate semiconductor chips, then the device can handle higher power and complexity, but wiring inductance variations increase causing oscillation and stability issues
Solution Approach 1:
By directly connecting output electrodes from different insulated circuit boards via inter-board wiring members, the patent creates equipotential points across multiple boards. This ensures that even as power handling capability increases with more boards, the voltage remains stable and oscillation-free across all output points
3Ease of manufacture
If conventional wiring methods are used with standard inductance values, then the manufacturing process is simple, but the wiring resistance and inductance cause potential differences and oscillation among chips
Solution Approach 1:
The patent achieves precise potential difference control (0.05V or less) by directly bonding output electrodes together, eliminating the need for complex impedance matching or precision wiring designs. This approach maintains manufacturing simplicity while achieving high precision in potential equalization
Solution Approach 2:
The patent uses identical inter-board wiring members with standardized connection methods across all insulated circuit boards. This copying of the same connection structure ensures consistent inductance values and simplifies the manufacturing process while maintaining precise potential control across all chip connections
Data Source
AI summary
A semiconductor device includes first semiconductor chips that each include a first control electrode and a first output electrode, second semiconductor chips each include a second control electrode and a second output electrode, first and second input circuit patterns on which the first and second input electrodes are disposed, respectively, first and second control circuit patterns electrically connected to the first and second control electrodes, respectively, first and second resistive elements, and a first inter-board wiring member. The first control electrodes and first resistive element are electrically connected via the first control circuit pattern, the second control electrodes and second resistive element are electrically connected via the second control circuit pattern, and at least one of the first output electrodes and at least one of the second output electrodes are electrically connected to each other via the first inter-board wiring member.