Multi-Color LED Chip Layout for Faster Micro LED Transfer
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Solution Overview
Problem
The small size of Micro/Mini LED light emitting chips leads to a high quantity of chips requiring transfer, resulting in a lengthy and inefficient process, hindering industrialization due to the need for batch transfer of different colored chips.
Innovation Solution
A light emitting chip design where multiple epitaxial wafers of different colors share a common first electrode, arranged in an array on a substrate, allowing simultaneous transfer of multiple colored chips, reducing the number of electrodes and improving transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple colored light emitting chips are transferred separately in batches, then each batch can be processed individually, but the number of transfers increases and the transfer time becomes very long
Solution Approach 1:
The patent combines multiple light emitting chips of different colors (red, green, blue) into a single integrated chip structure. Multiple epitaxial wafers are grown on the same substrate and processed together, allowing all colored chips to be transferred simultaneously as one unit rather than in separate batches, thereby reducing transfer time while maintaining accuracy
Solution Approach 2:
The patent performs preliminary actions by pre-arranging multiple epitaxial wafers of different colors on a common substrate before transfer. The chips are prepared, tested, and packaged together in advance as an integrated unit, eliminating the need for multiple separate transfer operations and reducing overall transfer time
2Ease of manufacture
If each light emitting chip has its own independent electrode, then electrical connection is simplified, but the number of electrodes increases and manufacturing complexity increases
Solution Approach 1:
The patent implements a shared electrode structure where a single common electrode serves multiple light emitting chips of different colors simultaneously. The electrode pattern is designed to provide electrical connection to multiple chips through a unified structure, reducing the total number of electrodes required while maintaining proper electrical connection for each chip
Solution Approach 2:
The patent merges multiple independent electrode structures into a single integrated electrode system. The electrode layer is configured to electrically connect to multiple epitaxial wafers through a shared connection structure, simplifying the manufacturing process by reducing the number of electrode fabrication steps and materials required
3Manufacturing precision
If the size of light emitting chips is reduced to Micro/Mini scale, then display resolution and pixel density are improved, but the quantity of chips increases dramatically making transfer and processing extremely time-consuming
Solution Approach 1:
The patent merges multiple Micro/Mini LED chips into a single integrated light emitting unit. By combining chips of different colors that would normally require separate handling into one unified structure, the patent maintains the small chip size benefits for high-resolution displays while dramatically improving transfer efficiency through simultaneous processing
Solution Approach 2:
The patent segments the light emitting structure into multiple functional layers (substrate, epitaxial wafers, electrode layers, insulation layers) that can be processed independently and then integrated. This segmentation allows for efficient manufacturing of individual layers followed by assembly into the final integrated chip, improving overall productivity
Data Source
AI summary
The present application provides a light emitting chip, a manufacturing method for the same, and a light emitting device, relating to the field of display technology. The light emitting chip includes a substrate and a plurality of light emitting units arranged in an array on the substrate. The light emitting unit includes at least one first electrode disposed on the substrate and a plurality of epitaxial wafers arranged in an array, at least two of the epitaxial wafers have different colors. Several epitaxial wafers in the epitaxial wafers share one of the first electrodes.