Multifold Micro LED Chip Structure for High-Resolution Transfer
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Solution Overview
Problem
Current display technologies face challenges in manufacturing high-resolution display apparatuses using micro light emitting devices, particularly in transferring and integrating micro-sized light emitting devices into desired pixel locations while maintaining the required electrical connections and color implementation.
Innovation Solution
A multifold micro light emitting device is developed, comprising a plurality of sub light emitting devices configured as a single chip, with a separator to electrically and optically isolate them, and a method for manufacturing this device that includes depositing semiconductor layers, forming electrodes, and separating the devices into chip units, allowing for efficient transfer and integration onto a driving substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple micro light emitting devices are manufactured separately, then each device can be individually controlled, but the transfer process becomes complex and time-consuming
Solution Approach 1:
Multiple micro light emitting devices are combined into a single chip structure, allowing them to be transferred as one unit rather than individually. This merging approach maintains the ability to control each device separately while dramatically simplifying the transfer process and increasing productivity.
Solution Approach 2:
The chip is segmented into multiple sub-chips, each containing a micro light emitting device. This segmentation allows individual control of each device while maintaining the structural integrity of the combined chip for simplified transfer operations.
2Manufacturing precision
If micro light emitting devices are miniaturized to achieve high resolution, then display quality improves, but manufacturing and transfer difficulties increase
Solution Approach 1:
Multiple miniaturized light emitting devices are merged into a single chip, maintaining high display resolution while making the overall structure easier to manufacture and transfer. The combined chip approach allows standard manufacturing processes to produce high-resolution displays without the extreme difficulty of handling individual micro-devices.
3Ease of manufacture
If multiple sub light emitting devices are integrated into a single chip, then transfer process is simplified, but electrical connection requirements become more complex
Solution Approach 1:
A common electrode structure is used across all sub-chips on the combined chip, providing a universal electrical connection method. This multi-functional electrode design simplifies the electrical connection process while maintaining the ability to independently control each micro light emitting device through the shared electrical infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the efficient transfer and integration of multiple sub light emitting devices as a single chip, reducing process difficulties due to miniaturization and maintaining high resolution by ensuring proper electrical connections and color implementation, thus simplifying the manufacturing of high-resolution display apparatuses.
Implementation Method 1
an active layer provided on the first type semiconductor layer, and a second type semiconductor layer provided on the active layer, the active layer configured to emit light
Implementation Method 2
The separator may include an insulator having a light absorption or reflection characteristic.
Implementation Method 3
The separator may include an insulator having a light absorption or reflection characteristic.
Data Source
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AI summary
Provided are a multifold micro emitting device, a display apparatus, a method of manufacturing the multifold micro emitting device, and method of manufacturing the display apparatus. The multifold micro light emitting device includes a plurality of sub light emitting devices, a first electrode configured to apply a voltage to each of the plurality of sub light emitting devices, a second electrode configured to apply a common voltage to the plurality of sub light emitting devices, and a separator configured to separate the plurality of sub light emitting devices from each other, and the plurality of sub light emitting devices are configured as a single chip.