Multi-Lane Electronic Component Mounting System with Flexible Work Modes
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Solution Overview
Problem
Conventional electronic component mounting equipment struggles to efficiently support both mass production of the same items and small volume production of various items, leading to difficulties in achieving high productivity and responsiveness to changing demands.
Innovation Solution
An electronic component mounting system with individual printing mechanisms, board conveyance mechanisms, and component mounting mechanisms that allow for simultaneous and concurrent operation across multiple boards, with a mode instruction portion to select between continuous and intermittent work modes based on board types, enabling flexible production strategies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional electronic component mounting equipment is used, then mass production of one and the same items can be achieved, but responsiveness to small volume production of many items deteriorates
Solution Approach 1:
The mounting line is divided into multiple independent mounting lanes (first mounting lane and second mounting lane), each capable of independently processing different board types. This segmentation allows simultaneous mass production in one lane while accommodating small volume production in another lane, resolving the contradiction between productivity and adaptability.
Solution Approach 2:
Each mounting lane is designed with universal functionality to handle multiple board types through interchangeable mounting heads and programmable control. The system can be configured via control device to switch between mass production mode (continuous operation on single board type) and small volume production mode (intermittent operation on multiple board types), enabling both production forms within the same equipment.
2Adaptability or versatility
If frequent model change is implemented for small volume production, then responsiveness to diverse demand is improved, but productivity deteriorates due to repeated setup change works
Solution Approach 1:
By dividing the mounting line into multiple independent lanes, setup changes are localized to only those lanes requiring model changes. Other lanes can continue production without interruption, thereby maintaining overall productivity while achieving the adaptability needed for frequent model changes.
Solution Approach 2:
The control device stores mounting conditions for multiple board types in advance. When a model change is required, the system can quickly retrieve and apply pre-configured parameters, reducing setup change time and minimizing productivity loss during transitions between different board types.
3Adaptability or versatility
If multiple general-purpose mounting lines are provided, then adaptability to diverse board types is improved, but device complexity and cost increase
Solution Approach 1:
Multiple mounting lanes are merged into a single integrated mounting line under unified control. This consolidation provides the adaptability of multiple general-purpose lines while reducing overall device complexity and space requirements. The control device coordinates all lanes to function as a unified system that can handle diverse board types.
Solution Approach 2:
Each mounting lane within the single line is designed with universal capabilities to handle multiple board types through programmable control and interchangeable components. This eliminates the need for separate dedicated lines for different board types, achieving high adaptability within a single integrated system.
Data Source
AI summary
An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently. Provided is an electronic component mounting line (1) which is formed so that a screen printing portion having a plurality of individual printing mechanisms capable of executing setup change works individually is connected to an upstream side of a component mounting portion having a plurality of board conveyance mechanisms, and which is configured so that either of a first work mode in which component mounting work is continuously executed on a fixed board type in all individual mounting lanes (L1 and L2) and a second work mode in which component mounting work is intermittently executed in one individual mounting lane while setup change work is repeated in corresponding one of the individual printing mechanisms whenever board types are changed from one to another in the individual mounting lane is selectively designated in multi-board mounting work in which the individual mounting lanes are operated to execute component mounting work on a plurality of boards simultaneously and concurrently.


