Multilayer Capacitor Asymmetric Electrode Design for Carrier Bonding

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing multilayer capacitors with reduced ESL face challenges in transportation and storage due to the deterioration of outer electrodes when bonded to a carrier sheet on one principal surface, requiring complex and costly holding methods.

Innovation Solution

A multilayer capacitor design with through holes in the inner electrodes for via conductors, where the first and second outer electrodes are only provided on the second principal surface, allowing for a simple bonding method to a carrier sheet without damaging the electrodes, and incorporating a lower protective region with dummy electrodes for enhanced strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If multilayer capacitors are bonded to one principal surface of a carrier sheet for simple holding, then holding simplicity and cost are improved, but outer electrodes deteriorate and reliability worsens

Engineering Contradiction:
Improveholding method simplicityVSAvoidouter electrode integrity
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent applies asymmetry by concentrating all outer electrodes on only one principal surface of the capacitor main body, while the opposite surface has no outer electrodes. This asymmetric electrode arrangement allows the capacitor to be bonded to the carrier sheet via the electrode-free surface, enabling simple holding methods without damaging the outer electrodes, thus resolving the contradiction between holding simplicity and electrode integrity

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent introduces an intermediary approach by designing the capacitor structure itself (asymmetric electrode placement) to accommodate the holding requirement, rather than using complex holding fixtures. This structural intermediary solution enables direct bonding to carrier sheets while protecting the outer electrodes from damage

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If carrier tape with recessed portions and sealing tape is used to hold multilayer capacitors, then outer electrode protection is improved, but device complexity and manufacturing cost worsen

Engineering Contradiction:
Improveouter electrode protectionVSAvoidholding structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By placing all outer electrodes on one surface only, the patent eliminates the need for complex protective holding structures. The asymmetric design allows capacitors to be simply bonded to flat carrier sheets without requiring recessed portions or sealing tapes, thus reducing device complexity while maintaining electrode protection

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent extracts the protective function from complex holding structures (recessed portions and sealing tapes) and integrates it into the capacitor's own structure through asymmetric electrode placement. This eliminates the need for separate protective holding mechanisms, reducing overall device complexity

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS11501923B2Multilayer capacitor and multilayer capacitor array
Publication Date: 2022.11.15 MURATA MFG CO LTD
  • US11501923B2 patent drawing
  • US11501923B2 patent drawing
  • US11501923B2 patent drawing

AI summary

A multilayer capacitor includes a capacitor main body including dielectric layers, first inner electrodes, and second inner electrodes that are laminated together, first outer electrodes, second outer electrodes, first via conductors that electrically connect the respective first outer electrodes to the first inner electrodes, and second via conductors that electrically connect the respective second outer electrodes to the second inner electrodes. Through holes are provided in the second inner electrodes, and the first via conductors pass through the through holes. Through holes are provided in the first inner electrodes, and the second via conductors pass through the through holes. The first outer electrodes and the second outer electrodes are not provided on the first principal surface of the capacitor main body and provided only on its second principal surface.