Multilayer Capacitor Electrode Structure for Corner Moisture Resistance
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Solution Overview
Problem
Conventional multilayer ceramic capacitors face challenges in achieving a high effective volume ratio and moisture resistance due to non-uniform external electrode thickness, which affects capacitance and reliability, especially at corner portions where the electrode is excessively thin, leading to potential water penetration and plating defects.
Innovation Solution
A multilayer electronic component design featuring a specific structure with alternately disposed internal electrodes and dielectric layers, along with a method involving transfer and dipping processes to form external electrodes, ensuring a uniform thickness at corner portions and improved bonding strength, thereby enhancing moisture resistance and capacitance per unit volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a dipping process is used to form external electrodes, then the manufacturing process is simple, but the external electrode thickness becomes non-uniform and excessively thin at corner portions
Solution Approach 1:
The patent divides the external electrode formation into multiple sequential dipping steps: first dipping to form a base layer, then second dipping to add additional material. This segmentation allows each step to contribute specifically to achieving both uniform thickness and adequate coverage at corner portions, resolving the contradiction between process simplicity and thickness uniformity.
Solution Approach 2:
The first dipping process performs a preliminary action by forming a base electrode layer that provides initial coverage and uniformity. This preliminary layer prepares the surface for the second dipping step, ensuring that corner portions receive adequate material deposition before the final electrode structure is completed.
2Quantity of substance
If the external electrode is formed thin to increase effective volume ratio, then capacitance per unit volume increases, but moisture resistance deteriorates due to water penetration at thin portions
Solution Approach 1:
The multi-step dipping process segments the electrode formation to achieve optimal thickness distribution: the first dip creates a uniform base layer that prevents water penetration pathways, while the second dip adds material to maximize coverage. This segmentation allows the electrode to be thin enough for high effective volume ratio while maintaining adequate thickness at critical corner portions for moisture resistance.
Solution Approach 2:
The patent applies local quality by ensuring that corner portions receive adequate electrode material through the sequential dipping process. The first dipping step establishes uniform coverage including corners, and the second step reinforces this coverage. This localized attention to corner portions ensures moisture resistance where it is most needed while maintaining overall thinness for high effective volume ratio.
3Reliability
If the external electrode is formed thick to improve moisture resistance, then reliability improves, but effective volume ratio decreases
Solution Approach 1:
The segmented dipping process allows precise control over electrode thickness and distribution. Rather than forming a uniformly thick electrode that would reduce effective volume, the process segments material deposition to provide adequate thickness only where necessary for moisture resistance (particularly at corner portions), while maintaining thinner sections in areas where capacitance volume is prioritized.
Solution Approach 2:
The patent implements local quality by varying electrode thickness according to functional requirements: corner portions receive sufficient material coverage from the sequential dipping process to prevent water penetration and ensure moisture resistance, while other portions maintain optimized thickness for maximum effective volume ratio and capacitance.
Data Source
AI summary
A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.