Multilayer Capacitor Electrode Structure for Delamination Resistance
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with decreased bonding strength and moisture resistance reliability due to warpage and step portions between internal electrodes and margin portions during manufacturing, leading to delamination and cracks.
Innovation Solution
The multilayer electronic component incorporates step compensation portions and intermediate electrodes in the internal electrode layers, which are spaced apart from the ends of the internal electrodes and dielectric layers, to stabilize the structure and prevent delamination, while maintaining moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a large number of internal electrodes and dielectric layers are stacked to increase capacitance, then high capacitance is achieved, but warpage of cover portions and step portions occur causing decreased bonding force and delamination
Solution Approach 1:
The patent applies preliminary action by forming margin portions on the internal electrodes before stacking the dielectric layers. These margin portions extend beyond the electrode edges and are prepared in advance to compensate for warpage and step portions that will occur during subsequent sintering processes. This pre-prepared structure prevents delamination by ensuring adequate bonding area is maintained even after thermal processing.
Solution Approach 2:
The patent applies local quality by creating margin portions with specific dimensional characteristics at critical locations where warpage and step portions occur. The margin portions have different dimensions (extending in length and width directions) tailored to the local warpage characteristics, providing enhanced bonding capability precisely where needed rather than uniformly across the entire electrode surface.
2Device complexity
If dielectric layers are made thicker to reduce layer count, then manufacturing complexity is reduced, but warpage and step portions increase causing delamination
Solution Approach 1:
The patent forms margin portions on internal electrodes before stacking thicker dielectric layers, preparing the bonding interface in advance to compensate for the increased warpage and step portions that result from using fewer, thicker layers. This preliminary structuring ensures that even with reduced layer count, the bonding force remains sufficient to prevent delamination.
3Ease of manufacture
If internal electrodes are printed first and then dielectric margin is reprinted, then alignment control and pattern precision deteriorate
Solution Approach 1:
The patent merges the formation of internal electrodes and margin portions into a single printing step, where both features are created simultaneously on the same green sheet. This eliminates the need for separate reprinting operations and the associated alignment issues, while still providing the benefits of margin portions for warpage compensation.
Data Source
AI summary
A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrode layers disposed with the dielectric layer interposed therebetween and having opposing first and second surfaces, opposing third and fourth surfaces, and opposing fifth and sixth surfaces; a first external electrode disposed on the third surface and connected to the first internal electrode layer; and a second external electrode disposed on the fourth surface and connected to the second internal electrode layer. The first internal electrode layer includes a first internal electrode, first step compensation portions disposed to be spaced apart from both ends of the first internal electrode, the third surface, and the fourth surface, and first intermediate electrodes disposed between the first internal electrode and the first step compensation portions and disposed to be spaced apart from the third surface and the fourth surface.