Multilayer Capacitor External Electrode Height Design
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Solution Overview
Problem
Existing multilayer capacitors face challenges in embedding in resin due to the small height of external electrodes, leading to exposure and oxidation of via conductors, resulting in defective capacitors during surface polishing or laser beam irradiation.
Innovation Solution
A multilayer capacitor design with external electrodes having heights equal to or larger than 50% of the capacitor body, allowing for secure exposure and connection without exposing via conductors, achieved through a manufacturing method involving conductive paste patterns, electrolytic plating, and controlled height formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the height of external electrodes is increased to enable embedding in resin, then the ease of manufacture is improved, but the device complexity increases
Solution Approach 1:
The external electrodes are formed with sufficient height in advance during the capacitor manufacturing process, before embedding in resin. This preliminary height formation enables subsequent resin embedding and surface polishing operations to be performed without exposing via conductors, thereby improving ease of manufacture while managing device complexity through advance preparation
2Reliability
If the height of external electrodes is increased to prevent via conductor exposure, then the reliability is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent specifies a quantitative parameter threshold: external electrode height should be 50% or more of the capacitor body height. This parameter change provides a clear manufacturing target that balances reliability (preventing via conductor exposure during resin embedding and polishing) with manufacturing precision (achievable height specification), resolving the contradiction between these two requirements
3Ease of operation
If surface polishing is performed to expose external electrodes, then the ease of operation is improved, but the risk of via conductor exposure increases
Solution Approach 1:
The external electrodes are designed with excess height (50% or more of capacitor body height) as a protective cushion before resin embedding and surface polishing operations. This beforehand cushioning ensures that even if polishing removes some material, the via conductors remain protected and are not exposed, thereby maintaining reliability while enabling ease of operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable electrical connection and high productivity by preventing via conductor exposure and oxidation, maintaining capacitor integrity during resin embedding and surface processing.
Implementation Method 1
a first external electrode electrically connected to the first via conductor and a second external electrode electrically connected to the second via conductor are formed by electrolytic plating
Data Source
AI summary
A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes, and first and second main surfaces, first and second external electrodes on at least one of the first and second main surfaces, first via conductors to electrically connect the first external electrode and the first internal electrodes, and second via conductors to electrically connect the second external electrode and the second internal electrodes, a direction in which the dielectric layer, the first internal electrode, and the second internal electrode are laminated is a height direction of the capacitor body, and a height of the capacitor body is about 100%, and a height of the first and second external electrodes is equal to or larger than about 50% with respect to the height of the capacitor body.