Multilayer Capacitor Electrode Structure Against Hydrogen Penetration
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in maintaining moisture resistance and reliability due to hydrogen penetration during the plating process, which can lead to short-circuits, insulation resistance deterioration, and increased short-circuit rates.
Innovation Solution
The multilayer electronic component incorporates external electrodes with a layered structure of Cu, Ni, and glass, where the second electrode layers include Ni and Cu, acting as a barrier to prevent moisture, hydrogen, and plating solution penetration, enhancing reliability even at thinner dielectric and internal electrode thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional plating process is used to form external electrodes, then the manufacturing process is simple and cost-effective, but hydrogen gas penetrates into the chip causing insulation resistance deterioration and reliability issues
Solution Approach 1:
The external electrode is segmented into multiple layers with different materials (Cu, Ni, Pd, Pt) stacked sequentially. Each layer serves a specific function: Cu provides conductivity, Ni acts as a diffusion barrier, Pd provides hermetic sealing, and Pt offers corrosion resistance. This segmentation prevents hydrogen penetration while maintaining manufacturing feasibility
Solution Approach 2:
The external electrode uses a composite structure combining multiple materials (Cu-Ni-Pd-Pt) with complementary properties. The composite material system provides both hydrogen barrier functionality and electrical conductivity, resolving the contradiction between reliability and manufacturing simplicity
2Volume of moving object
If the dielectric layer and internal electrode thickness are reduced for miniaturization, then the component size is reduced, but moisture resistance and reliability deteriorate due to insufficient barrier properties
Solution Approach 1:
The patent applies local quality enhancement by adding a Pd layer specifically at the external electrode interface where hermetic sealing is most critical. This localized improvement in barrier properties protects the thinned dielectric layer without requiring overall thickening of the component structure
Solution Approach 2:
Instead of increasing thickness in the vertical dimension to improve moisture resistance, the patent adds functional layers in the horizontal dimension (multiple material layers). This dimensional approach maintains miniaturization while achieving superior barrier properties through material composition rather than geometric scaling
3Reliability
If a multi-layer external electrode structure with Cu, Ni, and glass is implemented, then moisture and hydrogen resistance are significantly improved, but the device complexity and manufacturing process become more complex
Solution Approach 1:
The patent merges multiple functions (conductivity, diffusion barrier, hermetic sealing, corrosion resistance) into a single integrated external electrode assembly. By combining these functions in one multi-layer structure rather than separate components, the patent reduces overall device complexity while achieving superior moisture resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the reliability and insulation resistance of the multilayer electronic component by effectively blocking hydrogen and moisture, reducing the risk of short-circuits and maintaining high capacitance and miniaturization capabilities.
Implementation Method 1
a second electrode layer disposed on the first electrode layer and including Ni and Cu
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.